New Derivatives of Levulinic Acid. I. Synthesis of 2,3-Epoxy-3-Methyladipic Esters [PDF]
, 1955 Eturô Maekawa +2 more
openalex +1 more source
Magnetism in graphite oxide: The role of epoxy groups [PDF]
arXiv, 2010 We investigate the magnetism in graphite by controlled oxidation. Our approach renders graphite an insulator while maintaining its structure. Fourier transform infrared spectroscopy and X-ray absorption near edge structure spectra reveal that graphite oxide has epoxy groups on its surface and it is not thermally stable.
arxiv
EPON® 828... from TOP to BOTTOM, the recognized performance standard for liquid epoxies [PDF]
, 1959 openalex +1 more source
When you think of epoxy resins come to the people who pioneered in the development and manufacturer of them! [PDF]
, 1959 openalex +1 more source
FTIR and GCMS analysis of epoxy resin decomposition products feeding the flame during UL 94 standard flammability test. Application to the understanding of the blowing-out effect in epoxy/polyhedral silsesquioxane formulations [PDF]
arXiv, 2018 A novel method was developed for the sampling of volatiles produces by polymer decomposition during UL94 standard flammability tests, allowing to collect, separate and analyze the precise composition of the fuel mixture feeding the flame in the real flammability tests.
arxiv
React Epoxies with Z6018 Silicone Intermediate for Superior Electrical Resins [PDF]
, 1958 openalex +1 more source
Sodium storage via single epoxy group on graphene - The role of surface doping [PDF]
arXiv, 2018 Due to its unique physical and chemical properties, graphene is being considered as a promising material for energy conversion and storage applications. Introduction of functional groups and dopants on/in graphene is a useful strategy for tuning its properties.
arxiv
Test boat demonstrates exciting properties of Versamid-epoxy alloy laminates! [PDF]
, 1956 openalex +1 more source
Evaluation of the impact of solder die attach versus epoxy die attach in a state of the art power package [PDF]
Dans 13th International Worshop on THERMal INvestigations of ICs
and Systems - THERMINIC 2007, Budapest : Hongrie (2007), 2008 Subject of this paper is the thermal investigation of epoxy (EDA) and solder (SDA) die attaches by a comparison of an ASIC with multiple heat sources in different package assemblies. Static and transient thermal measurements and simulations were performed to investigate the thermal behavior of two samples in a state of the art QFP power package ...
arxiv