Results 1 to 10 of about 280,134 (122)
Catalytic disconnection of C–O bonds in epoxy resins and composites
Nature, 2023 Fibre-reinforced epoxy composites are well established in regard to load-bearing applications in the aerospace, automotive and wind power industries, owing to their light weight and high durability.
A. Ahrens +9 more
semanticscholar +1 more source
Nano-Micro Letters, 2022 The rGH@FeNi/epoxy electromagnetic interference (EMI) shielding composites with regular 3D honeycomb structures were prepared by sacrificial template, freeze-drying and vacuum-assisted impregnation of epoxy resin.
Ping Song +4 more
semanticscholar +1 more source
Network Formation and Physical Properties of Epoxy Resins for Future Practical Applications
JACS Au, 2022 Epoxy resins are used in various fields in a wide range of applications such as coatings, adhesives, modeling compounds, impregnation materials, high-performance composites, insulating materials, and encapsulating and packaging materials for electronic ...
A. Shundo, Satoru Yamamoto, Keiji Tanaka
semanticscholar +1 more source
Nano-Micro Letters, 2022 High‑efficiency electromagnetic interference (EMI) shielding materials are of great importance for electronic equipment reliability, information security and human health.
Wen Wang +5 more
semanticscholar +1 more source
Advanced Composites and Hybrid Materials, 2022 In this work, the engineered polyaniline (PANI)/epoxy composites reinforced with PANI-M (physical mixture of PANI spheres and fibers) exhibit significantly enhanced electromagnetic wave absorption performance and mechanical property.
Jiang Guo +11 more
semanticscholar +1 more source
Hybridization Effect on Mechanical Properties of Basalt/Kevlar/Epoxy Composite Laminates
Polymers, 2022 The present work investigates the fabrication of Kevlar/epoxy and basalt/epoxy and Kevlar/basalt/epoxy hybrid composite laminates and compares their mechanical properties.
Ramesh Velumayil, A. Palanivel
semanticscholar +1 more source
ACS Applied Materials and Interfaces, 2020 The effective dissipation of heat is critical to the performance and longevity of high power electronics, so it is important to prepare highly thermally conductive polymer-based packaging materials for efficient thermal management.
Zhan Liu, Junhui Li, Xiaohe Liu
semanticscholar +1 more source
Scientific Reports, 2021 Dielectric materials with good thermal transport performance and desirable dielectric properties have significant potential to address the critical challenges of heat dissipation for microelectronic devices and power equipment under high electric field ...
Zhengdong Wang +7 more
semanticscholar +1 more source
IMPROVEMENTS IN EPOXY RESIN EMBEDDING METHODS
The Journal of Biophysical and Biochemical Cytology, 1961 Epoxy embedding methods of Glauert and Kushida have been modified so as to yield rapid, reproducible, and convenient embedding methods for electron microscopy. The sections are robust and tissue damage is less than with methacrylate embedding.
J. Luft
semanticscholar +1 more source
Nanomaterials, 2021 The microwave properties of epoxy composites filled with 30 wt.% of BaFe12–xGaxO19 (0.1 ≤ x ≤ 1.2) and with 1 wt.% of multi-walled carbon nanotubes (CNTs) were investigated in the frequency range 36–55 GHz.
O. Yakovenko +6 more
semanticscholar +1 more source