Results 61 to 70 of about 381 (169)

Observation of Topological Chirality Switching Induced Freezing of a Skyrmion Crystal

Advanced Materials, EarlyView.
Using Lorentz Transmission electron microscopy, it is shown that in the insulating van der Waals ferromagnet, CrBr3, a magnetic field can cause Bloch skyrmionic bubbles to spontaneously switch their chirality. As achiral type‐II bubbles are an intermediate state, the bubbles rapidly elongate and shrink when switching, thereby inducing a freezing of the
John Fullerton, Yue Li, Harshvardhan Solanki, Sergey Grebenchuk, Magdalena Grzeszczyk, Zhaolong Chen, Makars Šiškins, Kostya S. Novoselov, Maciej Koperski, Elton J. G. Santos, Charudatta Phatak   +10 more
wiley   +1 more source

Transition of Néel‐Type and Bloch‐Néel Hybrid Skyrmion in a Metallic Multilayer Material System

Advanced Materials, EarlyView.
This work demonstrated a framework for manipulating multiple skyrmion types in [Pt/Co/Cu]5 multilayers through bias‐driven thermal effects. Distinct Néel and hybrid skyrmion phases can be selectively stabilized, enabling binary encoding beyond chirality‐based schemes.
Binbin Wang, Núria Bagués, Shuyu Cheng, Shekhar Das, Camelia Selcu, Ziling Li, Jacob B. Freyermuth, Denis V. Pelekhov, P Chris Hammel, Mohit Randeria, Roland K. Kawakami, David W. McComb   +11 more
wiley   +1 more source

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, 2017
Валерий Александрович Щеголев, Валерий Петрович Сущенко   +1 more
openalex   +1 more source

2D Indium Oxide at the Epitaxial Graphene/SIC Interface: Synthesis, Structure, Properties, and Devices

Advanced Materials, EarlyView.
A new monolayer insulator, InO2, is synthesized by intercalating indium beneath patterned epitaxial graphene on SiC, followed by high‐temperature oxidation. This selective confinement yields large‐area, uniform InO2 with a wide bandgap of 4.1 eV. Upon intercalation, the EG/n‐SiC junction transitions from ohmic to Schottky, exhibiting a rectification ...
Furkan Turker, Bohan Xu, Chengye Dong, Michael Labella III, Nadire Nayir, Natalya Sheremetyeva, Zachary J. Trdinich, Duanchen Zhang, Gokay Adabasi, Bita Pourbahari, Li‐Syuan Lu, Wesley E. Auker, Ke Wang, Mehmet Baykara, Vincent Meunier, Nabil Bassim, Adri C. T. van Duin, Vincent H. Crespi, Joshua A. Robinson   +18 more
wiley   +1 more source

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, 2017
Екатерина Владимировна Юсифова
openalex   +1 more source

Physical Adsorption‐Driven Assembly of Au‐Locked Nucleic Acid (LNA) Probes on MoS2 Nanosheets for SERS‐Based Detection of microRNAs (miRNAs)

Advanced Materials Interfaces, EarlyView.
The Au‐LNA Raman probe, composed of gold nanoparticles (AuNPs), thiol functional group, and Cy3 modified LNAs, synthesized after hybridization of LNA and miR‐210‐3p target, is integrated into the MoS2@Au composite. The integration of the nanocomposite is formed by physical adsorption of Au‐LNA nanohybrid with MoS2. Characterization confirms morphology,
Faith Mokobi Zablon, Md. Arifur Rahman Khan, Tetyana Ignatova, Kristen Dellinger, Shyam Aravamudhan   +4 more
wiley   +1 more source

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, 2017
Андрей Юрьевич Глотов
openalex   +1 more source

Data Driven Control of Defect Formation in Solution Deposited Sb2Se3 Thin Films

Advanced Materials Interfaces, EarlyView.
A data‐driven design of experiments (DoE) approach is used to uncover how six interdependent processing parameters govern defect formation in solution‐deposited Sb2Se3 thin films. Statistical modeling revealed strong non‐linear couplings that control film quality, and the optimized films showed a threefold enhancement in photoresponse, demonstrating ...
Marissa J. Strumolo, Zhaohong Sun, Iliya Larimojarad, Rehan Kapadia, Richard L. Brutchey   +4 more
wiley   +1 more source

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, 2018
Анастасия Иванова
openalex   +1 more source

Printed Interconnects for Heterogeneous Systems Integration on Flexible Substrates

Advanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.
Key components (sensors, energy devices, communication devices, computing chips, and interconnects) of flexible hybrid electronic (FHE) system connected via conductive printed metal tracks. The figure in the insets shows out‐of‐plane printed interconnects providing opportunities for lithography‐free formation of VIAs, in‐plane access of UTCs pads, and ...
Abhishek Singh Dahiya, Adamos Christou, Sihang Ma, Ravinder Dahiya   +3 more
wiley   +1 more source