Results 161 to 170 of about 6,781,577 (302)

Additive Manufacturing of High‐Performance Polymers for Extreme Environments

Advanced Science, EarlyView.
Additive manufacturing of high‐performance polymers for extreme environments is critically reviewed through an integrated chemistry‐processing‐structure‐property‐qualification framework. The review compares fused filament fabrication, selective laser sintering, and direct ink writing, linking rheology and thermal history to crystallization, defect ...
Md Tofazzal Hossain, Mohammed Intishar Nur, Md Shajedul Hoque Thakur, Indranil Dey, Md Mesbahul Maruf, Md Jahid Hasan, Suryasarathi Bose, Muhammad M. Rahman   +7 more
wiley   +1 more source

Abnormal behavior capture of video dynamic target based on 3D convolutional neural network. [PDF]

Front Neurorobot, 2022
Chen F.
europepmc   +1 more source

Deep‐Learning‐Based Denoising for Improved Phase Precision in Electron Holography of Electromagnetic Fields in Nanoscale Materials

Advanced Science, EarlyView.
Low‐dose electron holography is limited by shot noise, which buries weak phase signals. HoloDenoiser, a physics‐informed network that works simultaneously in the spatial and frequency domains, locates and protects the holographic sideband while suppressing noise in the hologram.
Ye Luo, Luyang Wang, Zhiling Yu, Xiaowen Chen, Xiaoyu Wang, Ya‐Hui Jia, Thibaud Denneulin, Yu Han, Rafal E. Dunin‐Borkowski, Fengshan Zheng, Qi Liu   +10 more
wiley   +1 more source

Facial Micro-Expression Recognition Using Double-Stream 3D Convolutional Neural Network with Domain Adaptation. [PDF]

Sensors (Basel), 2023
Li Z, Zhang Y, Xing H, Chan KL.
europepmc   +1 more source

Wafer‐Scale 3D Integration for High‐Density Multi‐Valued Neuromorphic Logic

Advanced Science, EarlyView.
Wafer‐scale 3D vertically integrated multi‐valued logic (MVL) circuits are realized by monolithically integrating a Te/IGZO heterojunction FET with an engineered Te pull‐up FET. Heterointerface‐mediated transport and optimized current matching enable stable ternary operation, while vertical stacking reduces circuit footprint and interconnect complexity,
Chang‐Hyeon Kim, Min Seok Kim, Joong Bum Rhim, Tae In Kim, Hyuck‐In Kwon, Ick‐Joon Park   +5 more
wiley   +1 more source

Automated quality assurance of rigid brain CT/MR image registration using a 3D convolutional neural network. [PDF]

J Appl Clin Med Phys
Chahrour ZA, Obeid NF, El-Zaart A, El Kanawati W, Mkanna A, Assaf R, Shahine BH.   +6 more
europepmc   +1 more source

Non-destructive detection of single-seed viability in maize using hyperspectral imaging technology and multi-scale 3D convolutional neural network. [PDF]

Front Plant Sci, 2023
Fan Y, An T, Wang Q, Yang G, Huang W, Wang Z, Zhao C, Tian X.   +7 more
europepmc   +1 more source

Atomistic Kinetics of Dislocation‐Mediated Grain Growth in Monolayer MoS2

Advanced Science, EarlyView.
Atomic‐resolution in‐situ heating microscopy directly visualizes dislocation‐mediated grain boundary migration and grain growth in monolayer MoS2. Mobile grain boundaries migrate through collective motion of Mo 5|7 dislocations, whereas S 5|7 defects remain largely immobile.
Chang‐Won Choi, Min‐Yeong Choi, Tao Du, Jinho Rhee, Seokho Moon, Yeon‐Seo Nam, Xiaoyan Lu, Jong Kyu Kim, Jungwon Park, Moon‐Ho Jo, Cheol‐Joo Kim, Si‐Young Choi   +11 more
wiley   +1 more source

Construction and validation of a unified 3D convolutional neural network framework for automated identification of cervical spinal cord injury based on CT imaging. [PDF]

BMC Med Imaging
Ou D, Mo Y, Huang Y, Ye Y, Lin S, Pan L, Lin R, Huang S, Pan S.   +8 more
europepmc   +1 more source

Accelerating 3D Convolutional Neural Network with Channel Bottleneck Module for EEG-Based Emotion Recognition. [PDF]

Sensors (Basel), 2022
Kim S, Kim TS, Lee WH.
europepmc   +1 more source