Results 271 to 280 of about 566,211 (326)
Influence of Printing Orientation and Ageing on Mechanical Properties of 3D-Printed Resins for Occlusal Splints. [PDF]
Bosoni C +4 more
europepmc +1 more source
Shape‐Changing Multiphase Microparticles from Complex Liquid Crystal Emulsions
Liquid crystalline network (LCN) microparticles are prepared from single, double (Janus), and triple emulsions through a simple and scalable bulk‐emulsification strategy. Under heating, the particles exhibit robust, reversible, large‐amplitude deformations that depend both on the morphology and the liquid crystals director field configuration.
Marco Turriani +3 more
wiley +1 more source
Novel 3D-printed aids for total ear reconstruction. [PDF]
Schoenfeld L +6 more
europepmc +1 more source
Engineering Strategies for Stable and Long‐Life Alkaline Zinc‐Based Flow Batteries
Alkaline zinc‐based flow batteries face persistent challenges from unstable zinc deposition, including dendrite growth, passivation, corrosion, and hydrogen evolution, which severely limit cycling stability. Current research addresses these issues through coordinated electrode structuring, electrolyte regulation, and membrane design to control zinc ...
Yuran Bai +6 more
wiley +1 more source
Performance evaluation of 3D-printed geopolymer monoliths for cadmium adsorption. [PDF]
Siddiqui S +3 more
europepmc +1 more source
A swelling‐programmed micropatterned hydrogel guides adherent cells through a controlled transition from cell–matrix anchoring to cadherin‐mediated cell–cell compaction, enabling rapid assembly of high‐viability spheroids with defined size and morphology.
Han Gyeol Nam +8 more
wiley +1 more source
Chest wall stabilization following hemi-sternectomy assisted by 3D printed model. [PDF]
Nichols PL +4 more
europepmc +1 more source
Auxeticity‑by‑Assembly converts freeform photovoltaics from cut‑defined layouts to assembly‑defined systems. Standardized interlocking units generate negative‑Poisson‑ratio, reconfigurable architectures, while hinge regions are wired by selectively activatable AgNW–GO@EGaIn composite interconnects and a folding‑enabled interconnector layer. A decimeter‑
Seok Joon Hwang +15 more
wiley +1 more source

