Results 221 to 230 of about 100,069 (264)
Choline chloride (ChCl) additive enables dynamic interface engineering in Zn‐I2 batteries by forming hydrophobic polyiodide complexes and a Zn‐stabilizing Ch+‐rich layer under electric field modulation. This dual‐function strategy suppresses iodine hydrolysis and dendrite formation, while optimizing Zn2+ solvation and transport for high‐efficiency ...
Xiaoyu Bi +16 more
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3d Modeling and simulation of a harpsichord
Computing and Visualization in Science, 2020zbMATH Open Web Interface contents unavailable due to conflicting licenses.
Lukas Larisch +2 more
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Proceedings Visualization '93, 2002
We show how to create 3D models of maternal pelvis and fetal head from magnetic resonance images (MRI). The models are used to simulate the progress of delivery in order to give a prognosis of successful labor. >
Jean-Daniel Boissonnat, Bernhard Geiger
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We show how to create 3D models of maternal pelvis and fetal head from magnetic resonance images (MRI). The models are used to simulate the progress of delivery in order to give a prognosis of successful labor. >
Jean-Daniel Boissonnat, Bernhard Geiger
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A Cloud Based Simulation Service for 3D Crowd Simulations
Crowd simulation can play a crucial role when it comes to the design of Smart Environments. Crowd simulation can give insights on the flow of pedestrian in particular facilities and explore the interplay between ambient intelligence deployments and users.
Rafael Pax +3 more
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3D weather simulation on 3D virtual earth
2012 IEEE International Geoscience and Remote Sensing Symposium, 2012This paper conducted some researches on 3D weather simulations on a 3D virtual earth GeoGlobe. The simulation area in this paper is ZuiYi city, GuiZhou province, China, and the simulated weather conditions are snow, rain and fog. This paper used Microsoft's DirectX 3D Technology and particle system to achieve the simulation, and used a public weather ...
Hao Feng, Hong Fan
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3D simulation of tool machining
Computers & Graphics, 2003Abstract This paper describes a 3D tool machining simulation system. The initial tool and the grinding wheels are integrated with the machine tool. The application reads and interprets the CNC program code that controls the machine, it computes the positions and the motion of components and it translates the sequence of machining operations into ...
Anna Puig +2 more
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Simulation of 3D laser systems
2009 IEEE International Geoscience and Remote Sensing Symposium, 2009This paper deals with modeling of new optical non-conventional imaging with laser systems. In this paper, we present the simulation of the 3D ladar sensor including physics based modeling of laser backscattering from complex rough targets, reflectance modeling of porous occluders, development of 3D scenes and reconstruction algorithms for ...
Gérard Berginc, Michel Jouffroy
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Simulation and 3D Characterization of Microsystems
2007 IEEE International Conference on Microelectronic Systems Education (MSE'07), 2007To add more functionalities to microelectronic circuits, microsystems offer growing number of applications. An advanced practical work that combines simulation and optical characterization of microsystems is presented in this paper. It emphases through simulation and characterization results the different characteristics of some of the most utilized ...
Bogdan Bercu +3 more
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3D simulations of interacting particles
Computing in Science & Engineering, 2000At the Institute for Science Education, a simulation program named xyZET has been developed and combined with an introductory course in mechanics to demonstrate its usefulness in teaching and learning physics. One of its distinct features enables the visualization of the movement of interacting particles in 3D.
H. Hortel, Michael Lüdke
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Simulation in 3D integration and TSV
2014 IEEE 5th Latin American Symposium on Circuits and Systems, 2014The development of 3D-silicon integrated circuits is an increasing demand especially regarding to advanced 3D-packages and high performance applications, with the intend to miniaturize and to reduce costs. Through-silicon-vias (TSV), interconnects and landing pads have a strong mismatch in proportions.
Kirsten Weide-Zaage +2 more
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