An Injection‐Molded Modified Silicone Rubber for Cancer‐on‐Chip Applications
This study describes the characterization and application of an injection‐molded functionalized PDMS fluidic insert for the commercially available Micronit system. Modified PDMS can accommodate cell culture and is able to covalently bind proteins for long‐lasting coatings under flow‐conditions.
Ben J. Haspels+7 more
wiley +1 more source
Transformative collaborations in a time of change: Europe's unique model for public-private-philanthropic partnerships. [PDF]
Hurtado Del Pozo C, Blomberg N.
europepmc +1 more source
This article introduces a hybrid manufacturing approach to create conductive pathways in additively manufactured fully‐aromatic polyimides. This is enabled through a combination of high‐resolution laser scribing process for fabricating graphene and metallizing it with electrodeposition of copper to further increase conductivity.
Heather D. Wotton+6 more
wiley +1 more source
Decoding public sentiment topics in google map reviews on urban infrastructure development of belt and road initiative. [PDF]
Xiong Y, Liang J, Guan C.
europepmc +1 more source
Advanced Optical Integration Processes for Photonic‐Integrated Circuit Packaging
Photonic integrated chip packaging is a growing technology that helps make devices faster, more efficient, and more compact by using light instead of electricity. This review highlights recent progress in making these chips work better at different levels, discusses current challenges like heat and alignment, and looks at future possibilities for ...
Keuntae Baek+4 more
wiley +1 more source
This research presents an easy to fabricate, low‐cost, flexible piezoresistive deformation sensor comprised of a carbon nanotube, few‐layer graphene, and polydimethylsiloxane composite. The sensor detects deformations and vibrations up to 600 Hz with 0.1% strain sensitivity from stiff and soft targets in dry and wet environments.
Sinan Candan+9 more
wiley +1 more source
The impact of digital technology on total factor productivity in manufacturing enterprises. [PDF]
Tu J, Wei X, Razik MAB.
europepmc +1 more source
Silicon‐Integrated Next‐Generation Plasmonic Devices for Energy‐Efficient Semiconductor Applications
Silicon (Si)‐integrated plasmonics offer a pathway to next‐generation, energy‐efficient semiconductor applications. This review highlights advances using complementary metal–oxide–semiconductor (CMOS)‐compatible materials like transparent conductive oxides and novel architectures, particularly coupled hybrid plasmonic waveguides (CHPWs).
Nasir Alfaraj, Amr S. Helmy
wiley +1 more source
Developing and streamlining clinical trial services to support pediatric drug development across 21 countries in Europe: insights from the conect4children (c4c) network. [PDF]
Attar S+13 more
europepmc +1 more source
Enhancing Damage Tolerance of Structures Using 3D/4D Printing Technologies
This review highlights recent advances in damage tolerance for structural design, emphasizing safety, durability, and reliability in fields like aerospace and civil engineering. It covers innovations in materials, 3D/4D printing, predictive design methods, and nature‐inspired strategies.
Morteza Sayah Irani+3 more
wiley +1 more source