Results 191 to 200 of about 543,653 (247)

Two‐Step Thermal Upcycling of Flexible Printed Circuit Board Waste Into Metallic Copper Nanoparticles: Synthesis and Characterization

open access: yesAdvanced Materials Technologies, EarlyView.
A two‐step thermal upcycling process converts flexible printed circuit board waste into high‐purity copper nanoparticles using polymer degradation and arc discharge. The synthesized nanoparticles exhibit controlled morphology and high metal purity.
Bikesh S. Ghinangju   +2 more
wiley   +1 more source

Conductive Tin Oxide Under the Thermal Budget of Perovskite/TOPCon Tandems: Toward Indium‐Free Contacts

open access: yesAdvanced Materials Technologies, EarlyView.
This work demonstrates that achieving conductive undoped SnOx contacts required careful tailoring of oxygen vacancy (VO) tuning and defect engineering. Controlling oxygen deposition pressure and low‐temperature annealing (300°C) optimizes defect stoichiometry and mitigates carrier scattering. This low thermal budget approach significantly enhances Hall
Paul Llontop   +13 more
wiley   +1 more source

Has the required heparin dose increased in PCI? A single-centre experience. [PDF]

open access: yesBr J Cardiol
Kira M   +14 more
europepmc   +1 more source

Home - About - Disclaimer - Privacy