Results 151 to 160 of about 96,792 (346)
Recent Progress on Flexible Multimodal Sensors: Decoupling Strategies, Fabrication and Applications
Advanced Materials, EarlyView.In this review, we establish a tripartite decoupling framework for flexible multimodal sensors, which elucidates the underlying principles of signal crosstalk and their solutions through material design, structural engineering, and AI algorithms. We also demonstrate its potential applications across environmental monitoring, health monitoring, human ...
Tao Wu +10 more
wiley +1 more source
ACOUSTICAL IMPEDANCE OF EAR SIMULATORS AND THE REVISION OF IEC 60318-1 [PDF]
, 2023 R G Barham
openalex +1 more source
Advanced Materials Interfaces, EarlyView.Hybrid piezoelectric scaffolds offer a promising route for Central Nervous System regeneration by combining structural and electrical cues to support neural stem cell growth. This review highlights their potential to overcome current challenges in neural tissue engineering by exploring porous hybrid materials, their biological interactions, and ...
Heather F. Titterton +2 more
wiley +1 more source
MEMS‐Based Magnetoelectric Antennas for Wireless Power Transmission in Brain‐Implantable Devices
Advanced Materials Technologies, EarlyView.Magnetoelectric (ME) antennas allow the minimization of the invasiveness of brain implantable devices, via powering wirelessly systems able to actuate neural tissue. In order to achieve the necessary power efficiency transmission, the choice of the materials and the system assembly is vital.
Laura Mazón‐Maldonado +5 more
wiley +1 more source
Zhongguo Jianchuan YanjiuObjectiveAs specific and demanding requirements are imposed by measuring the impedance of the anechoic coatings on the hull surface of an underwater vehicle using the traditional water-filled tube experiment, a method of sound absorption coefficient ...
Fan ZHANG +3 more
doaj +1 more source
Advancements in TLP Bonding for Power Electronics Die‐Attach Applications
Advanced Materials Technologies, EarlyView.Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal +4 more
wiley +1 more source
Archives of Acoustics, 2014 In the paper the mutual impedance of circular planar sources with parabolic vibration velocity distribution occurring harmoniously in time is analyzed. It is assumed that the sources set in planar rigid baffle radiate into a lossless and homogeneous gas ...
L. LENIOWSKA, W. RDZANEK, P. WITKOWSKI
doaj
Strategies for Enhancing Thermal Conductivity of PDMS in Electronic Applications
Advanced Materials Technologies, EarlyView.This review explores effective strategies for enhancing heat dissipation in Polydimethylsiloxane (PDMS)‐based composites, focusing on particle optimization, 3D network design, and multifunctional integration. It offers key insights into cutting‐edge methods and simulations that are advancing thermal management in modern electronic devices.
Xiang Yan, Marisol Martin‐Gonzalez
wiley +1 more source
Photothermomechanically Efficient, Low‐Cost, High‐Cycle‐Life, Hybrid MXene‐Polymer Actuators
Advanced Materials Technologies, EarlyView.The addition of MXenes to elastomer‐plastic‐paper films enables the creation of easily prepared actuators that are scalable for small robotic applications. Known as MXene‐polymer Trilayer Actuators (MPTAs), they bend from UV light. Their usefulness is demonstrated through kirigami‐inspired flower‐shaped art design, parallel manipulator for waveguiding,
Ken Iiyoshi +6 more
wiley +1 more source