Results 191 to 200 of about 319,219 (328)
Advancements in TLP Bonding for Power Electronics Die‐Attach Applications
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal +4 more
wiley +1 more source
Distinguishing Between Healthy and Unhealthy Newborns Based on Acoustic Features and Deep Learning Neural Networks Tuned by Bayesian Optimization and Random Search Algorithm. [PDF]
Lahmiri S, Tadj C, Gargour C.
europepmc +1 more source
Strategies for Enhancing Thermal Conductivity of PDMS in Electronic Applications
This review explores effective strategies for enhancing heat dissipation in Polydimethylsiloxane (PDMS)‐based composites, focusing on particle optimization, 3D network design, and multifunctional integration. It offers key insights into cutting‐edge methods and simulations that are advancing thermal management in modern electronic devices.
Xiang Yan, Marisol Martin‐Gonzalez
wiley +1 more source
Untethered Magnetic Microswimmers for Targeted Particle Transport and Flow Manipulation
This work introduces magnetically actuated microswimmers to dynamically reconfigure fluid flow within a single microfluidic device. Multiple homogeneous microswimmers are independently controlled by an external magnetic field to perform translational and rotational motions, thereby inducing real‐time flow manipulation.
Dineshkumar Loganathan +3 more
wiley +1 more source
Automated Nonlinear Acoustics System for Real-Time Monitoring of Cement-Based Composites. [PDF]
Kordatou TZ, Exarchos DA, Matikas TE.
europepmc +1 more source
Ultrasound‐Powered, Battery‐Free Implants via Triboelectric Energy Harvesting
Ultrasound‐driven triboelectric nanogenerators (US‐TENGs) present a promising approach to battery‐free implants by combining body‐safe ultrasound with the material and structural versatility of TENGs. This review categorizes current US‐TENG research into long‐term and transient short‐term applications and discusses key challenges in materials, device ...
Youngwook Chung +5 more
wiley +1 more source

