Results 191 to 200 of about 319,219 (328)

Advancements in TLP Bonding for Power Electronics Die‐Attach Applications

open access: yesAdvanced Materials Technologies, EarlyView.
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal   +4 more
wiley   +1 more source

Strategies for Enhancing Thermal Conductivity of PDMS in Electronic Applications

open access: yesAdvanced Materials Technologies, EarlyView.
This review explores effective strategies for enhancing heat dissipation in Polydimethylsiloxane (PDMS)‐based composites, focusing on particle optimization, 3D network design, and multifunctional integration. It offers key insights into cutting‐edge methods and simulations that are advancing thermal management in modern electronic devices.
Xiang Yan, Marisol Martin‐Gonzalez
wiley   +1 more source

Untethered Magnetic Microswimmers for Targeted Particle Transport and Flow Manipulation

open access: yesAdvanced Materials Technologies, EarlyView.
This work introduces magnetically actuated microswimmers to dynamically reconfigure fluid flow within a single microfluidic device. Multiple homogeneous microswimmers are independently controlled by an external magnetic field to perform translational and rotational motions, thereby inducing real‐time flow manipulation.
Dineshkumar Loganathan   +3 more
wiley   +1 more source

Ultrasound‐Powered, Battery‐Free Implants via Triboelectric Energy Harvesting

open access: yesAdvanced Materials Technologies, EarlyView.
Ultrasound‐driven triboelectric nanogenerators (US‐TENGs) present a promising approach to battery‐free implants by combining body‐safe ultrasound with the material and structural versatility of TENGs. This review categorizes current US‐TENG research into long‐term and transient short‐term applications and discusses key challenges in materials, device ...
Youngwook Chung   +5 more
wiley   +1 more source

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