Results 181 to 190 of about 19,877,463 (302)

Enhancement of the Through‐Thickness Electrical Conductivity of Carbon‐Fiber‐Reinforced Plastics Using Large Graphite Particles

Advanced Engineering Materials, EarlyView.
To enhance through‐thickness conductivity without sacrificing impregnation, large spherical graphite particles are intentionally employed in a low‐viscosity resin. Unlike finer conductive fillers, these particles remain outside the fiber bundles and accumulate in resin‐rich interlaminar regions during molding.
Keito Hosoe, Yu Zhou, Shintaro Kamiyama, Takao Okada, Tomohiro Yokozeki, Ryoma Tokonami, Tatsuhiro Takahashi   +6 more
wiley   +1 more source

On a Grover-Based Quantum Signature Scheme and a Teleportation-Based Design. [PDF]

Entropy (Basel)
Xu G, Xue S, Zou X, Zhang Y.
europepmc   +1 more source

A Multi‐Scale Machine Learning Framework for the Inverse Design of High Entropy Alloys

Advanced Engineering Materials, EarlyView.
High‐entropy alloys offer vast potential for various applications, including electrocatalysis; however, their compositional complexity challenges conventional screening. We introduce an inverse‐design framework combining two neural networks to determine optimal compositions and reconstruct nanoparticle geometry from targeted properties and conventional
Mikael Takoutsin, Marta Campolucci, Nicolas de Andrade Ishiki, Nathan Mirgot, Nadir Zhamantay, Frédéric Kanoufi, Jennifer Peron, Jean Charlety, Emiliano Fonda, Valérie Briois, Marco Faustini, Maria‐Letizia De Marco, Christine Goyhenex, Ovidiu Ersen, Hervé Bulou   +14 more
wiley   +1 more source

Overcoming Artificial Structures in Resolution-Enhanced Hi-C Data by Signal Decomposition and Multi-Scale Attention. [PDF]

Adv Sci (Weinh)
Li Q, Li KY, Nicoletti C, Tsui SK, Puri PL, Cao Q, Yip KY.   +6 more
europepmc   +1 more source

Thermal Cycle–Microstructure–Property Relationships in Rail Steel Heat‐Affected Zone Simulated by Gleeble

Advanced Engineering Materials, EarlyView.
Microstructural evolution of premium rail steel during flash butt welding (FBW), comparing physically simulated heat‐affected zones with actual weld regions. Thermal cycles induce phase transformations and microstructural heterogeneity that influence weld quality and mechanical performance. These findings provide insights into optimizing FBW parameters
Emmanoelle Cintra da Cunha Araújo, João Marcos da Silva Nunes, Marcelly Cristiny Nunes de Carvalho, Alex Rojas, Cristie Luis Kugelmeier, Cristhian Ricardo Loayza Loayza, João Carlos Ferreira, Maria Veronica Goncalves Rodrigues, Rute Sayuri Kano, Isaac Araújo Furtado, Jacyara Dalylla da Silva Nunes, Jhonatan Peres de Sousa, Marcos Natan da Silva Lima, Eden Santos Silva, Gedeon Silva Reis, Samuel Filgueiras Rodrigues   +15 more
wiley   +1 more source

Personalised energy targeting during venovenous ECMO: serial assessment of resting energy expenditure reveals phase-dependent metabolic demand and systematic discordance with predictive equations. [PDF]

Crit Care
Wilke SK, Behnel N, Weber-Carstens S, Edel A, Müller M, Mahlau A, Falk R, Ruß M, Wollersheim T.   +8 more
europepmc   +1 more source

All‐in‐One Analog AI Hardware: On‐Chip Training and Inference with Conductive‐Metal‐Oxide/HfOx ReRAM Devices

Advanced Functional Materials, EarlyView.
An all‐in‐one analog AI accelerator is presented, enabling on‐chip training, weight retention, and long‐term inference acceleration. It leverages a BEOL‐integrated CMO/HfOx ReRAM array with low‐voltage operation (<1.5 V), multi‐bit capability over 32 states, low programming noise (10 nS), and near‐ideal weight transfer.
Donato Francesco Falcone, Victoria Clerico, Wooseok Choi, Tommaso Stecconi, Folkert Horst, Laura Bégon‐Lours, Matteo Galetta, Antonio La Porta, Nikhil Garg, Fabien Alibart, Bert Jan Offrein, Valeria Bragaglia   +11 more
wiley   +1 more source

Processing, Microstructural Evolution and Engineering Performance of High-Entropy Alloys: A Review. [PDF]

Materials (Basel)
Zhang J, Xue J, Chen J, Xia T, Zhang W, Zhou W, Liu Y, Zhu J.   +7 more
europepmc   +1 more source

Printed Integrated Logic Circuits Based on Chitosan‐Gated Organic Transistors for Future Edible Systems

Advanced Functional Materials, EarlyView.
Edible electronics needs integrated logic circuits for computation and control. This work presents a potentially edible printed chitosan‐gated transistor with a design optimized for integration in circuits. Its implementation in integrated logic gates and circuits operating at low voltage (0.7 V) is demonstrated, as well as the compatibility with an ...
Giulia Coco, Valerio Francesco Annese, Valerio Galli, Ilaria Penna, Debora Russo, Marina Veronesi, Rita Scarpelli, Stefania Sabella, Mario Caironi   +8 more
wiley   +1 more source

Ópera actual: Ópera actual - Año I Número 1 - 1991 octubre (01/10/1991)

, 1991

core