Results 31 to 40 of about 713,277 (347)

Switchable Adhesion Actuator for Amphibious Climbing Soft Robot [PDF]

open access: yesSoft Robotics, 2018
Climbing soft robots are of tremendous interest in both science and engineering due to their potential applications in intelligent surveillance, inspection, maintenance, and detection under environments away from the ground.
Yichao Tang   +3 more
semanticscholar   +1 more source

Unrolling of Syngonium podophyllum: Functional Anatomy, Morphology and Modelling of Its Peltate Leaves

open access: yesAdvanced Biology, EarlyView.
The unrolling of the peltate leaves in Syngonium podophyllum is analyzed and quantified (left‐hand side to center). These measurements serve to verify a mathematical model for leaf unrolling based on the model used in Schmidt (2007). An additional formula for obtaining a layer mismatch from a prescribed radius is derived.
Michelle Modert   +4 more
wiley   +1 more source

Actuator device schedules rate of valve closure [PDF]

open access: yes, 1966
Prevalve actuator schedules the closure rate of a valve. The actuator is spring loaded to produce a normally open valve and pneumatically powered to close the valve.

core   +1 more source

Force measurements of a superconducting-film actuator for a cryogenic interferometric gravitational-wave detector

open access: yes, 2002
We measured forces applied by an actuator with a YBCO film at near 77 K for the Large-scale Cryogenic Gravitational-wave Telescope (LCGT) project. An actuator consisting of both a YBCO film of 1.6 micrometers thickness and 0.81 square centimeters area ...
A. Yamamoto   +21 more
core   +1 more source

Bistable Mechanisms 3D Printing for Mechanically Programmable Vibration Control

open access: yesAdvanced Engineering Materials, EarlyView.
This work introduces a 3D‐printed bistable mechanism integrated into tuned mass dampers (TMDs) for mechanically adaptive passive vibration suppression. Through optimized geometry, the bistable design provides adaptable vibration reduction across a broad range of scenarios, achieving effective vibration mitigation without complex controls or external ...
Ali Zolfagharian   +4 more
wiley   +1 more source

Mems device with large out-of-plane actuation and low-resistance interconnect and methods of use [PDF]

open access: yes, 2017
Source: United States Patent and Trademark Office, www.uspto.gov”The present application is directed to a MEMS device. The MEMS device includes a substrate having a first end and a second end extending along a longitudinal axis, the Substrate including ...
Beacken, Marc Jay   +5 more
core  

Simple piezoelectric-actuated mirror with 180 kHz servo bandwidth

open access: yes, 2010
We present a high bandwidth piezoelectric-actuated mirror for length stabilization of an optical cavity. The actuator displays a transfer function with a flat amplitude response and greater than 135$^\circ$ phase margin up to 200 kHz, allowing a 180 kHz ...
Abramovici   +26 more
core   +1 more source

Enhancing Corrosion Resistance and Mechanical Strength of 3D‐Printed Iron Polylactic Acid for Marine Applications via Laser Surface Texturing

open access: yesAdvanced Engineering Materials, EarlyView.
Laser surface texturing significantly improves the corrosion resistance and mechanical strength of 3D‐printed iron polylactic acid (Ir‐PLA) for marine applications. Optimal laser parameters reduce corrosion by 80% and enhance tensile strength by 25% and ductility by 15%.
Mohammad Rezayat   +6 more
wiley   +1 more source

Tunable mechanical coupling between driven microelectromechanical resonators

open access: yes, 2016
We present a microelectromechanical system, in which a silicon beam is attached to a comb-drive actuator, that is used to tune the tension in the silicon beam, and thus its resonance frequency.
Barzanjeh, S.   +7 more
core   +1 more source

Wafer Bonding Technologies for Microelectromechanical Systems and 3D ICs: Advances, Challenges, and Trends

open access: yesAdvanced Engineering Materials, EarlyView.
This review explores wafer bonding technologies, covering wafer preparation, activation methods, and bonding mechanisms. It compares direct and indirect bonding, highlights recent advancements and future trends, and examines applications in 3D integration and packaging.
Abdul Ahad Khan   +5 more
wiley   +1 more source

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