Results 231 to 240 of about 40,023 (305)

High-Precision 2D-DOA Estimation Method for Millimeter-Wave Radar Based on Double-Parallel Linear Array and Joint IAA-RIT. [PDF]

Sensors (Basel)
Yu D, Du L, Bai J, Chen Y.
europepmc   +1 more source

From the Discovery of the Giant Magnetocaloric Effect to the Development of High‐Power‐Density Systems

Advanced Materials Technologies, EarlyView.
The article overviews past and current efforts on caloric materials and systems, highlighting the contributions of Ames National Laboratory to the field. Solid‐state caloric heat pumping is an innovative method that can be implemented in a wide range of cooling and heating applications.
Agata Czernuszewicz, Yaroslav Mudryk, Jun Cui, Lucas Griffith, Duane D. Johnson, Julie Slaughter   +5 more
wiley   +1 more source

Design and implementation of a graphene-polyimide-based H-slot terahertz antenna for wireless and biomedical applications. [PDF]

PLoS One
Vineetha KV, Siva Kumar M, Rao BSS, Kumar OP, V SR, Madhav BTP.   +5 more
europepmc   +1 more source

Advanced Techniques for Scalable Woven E‐Textiles Manufacturing

Advanced Materials Technologies, EarlyView.
This review highlights recent advances in scalable weaving techniques for e‐textiles, emphasizing innovations in multilayer structures, conductive yarn integration, and loom modifications. It summarizes emerging materials, fabrication strategies, and performance considerations that enable reliable, durable, and industrially scalable woven electronic ...
Faisal Abedin, Seonyoung Youn, Amanda C. Mills   +2 more
wiley   +1 more source

A low-complexity M-shaped reconfigurable intelligent meta-surface for mitigating pathloss in wireless systems. [PDF]

Sci Rep
Khafagy M, Fathi S, Magdy A.
europepmc   +1 more source

Advancements in TLP Bonding for Power Electronics Die‐Attach Applications

Advanced Materials Technologies, EarlyView.
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal, Davey Boss, René H. Poelma, Elias Vlieg, John J. Schermer   +4 more
wiley   +1 more source

A Review of Solid-State LiDAR Principles and Metasurface-Based LiDAR Sensors. [PDF]

Sensors (Basel)
Demirbas E, Boucher B, Baker M, Andrews J, Cruz W, Mueller S, Serna-Otalvaro S.   +6 more
europepmc   +1 more source

Strategies for Enhancing Thermal Conductivity of PDMS in Electronic Applications

Advanced Materials Technologies, EarlyView.
This review explores effective strategies for enhancing heat dissipation in Polydimethylsiloxane (PDMS)‐based composites, focusing on particle optimization, 3D network design, and multifunctional integration. It offers key insights into cutting‐edge methods and simulations that are advancing thermal management in modern electronic devices.
Xiang Yan, Marisol Martin‐Gonzalez
wiley   +1 more source

Butler-Matrix Beamspace Front-Ends for Massive MIMO: Architecture, Loss Budget, and Capacity Impact. [PDF]

Sensors (Basel)
Vico F, Monserrat JF, Ge Y.
europepmc   +1 more source

Roadmap to Precision 3D Printing of Cellulose: Rheology‐Guided Formulation, Fidelity Assessment, and Application Horizons

Advanced Materials Technologies, EarlyView.
This critical review presents a comprehensive roadmap for the precision 3D printing of cellulose. Quantitative correlations link ink formulation and rheological properties to print fidelity and final material performance. This framework guides the development of advanced functional materials, from biomedical scaffolds to electromagnetic shielding ...
Majed Amini, Hadi Hosseini, Seyyed Alireza Hashemi, Mohammad Arjmand   +3 more
wiley   +1 more source