Results 181 to 190 of about 246,468 (245)

An Inkjet‐Printed Platinum‐Based Temperature Sensing Element on Polyimide Substrates

open access: yesAdvanced Engineering Materials, EarlyView.
An inkjet‐printed, meander‐structured, nanoparticle platinum‐based resistive temperature sensors on polyimide substrates are demonstrated as proof‐of‐concept. Optimized sintering at 250°C enables stable conductive structures. The Pt100‐ and Pt1000‐type sensors exhibit linear resistance–temperature characteristics with stable TCR in the 20°C–80°C range,
Shawon Alam   +6 more
wiley   +1 more source

Consumed by Abdominal Distention

open access: yes
Arthritis Care &Research, EarlyView.
Abimbola Fadairo‐Azinge   +3 more
wiley   +1 more source

Harnessing Fungal Biowelding for Constructing Mycelium‐Engineered Materials

open access: yesAdvanced Engineering Materials, EarlyView.
Mycelium‐bound composites (MBCs) offer low‐carbon alternatives for construction, yet interfacial bonding remains a critical challenge. This review examines fungal biowelding as a biocompatible adhesive, elucidating mycelium‐mediated interfacial mechanisms and their role in material assembly. Strategies to optimize biowelding are discussed, highlighting
Xue Brenda Bai   +2 more
wiley   +1 more source

On the Lightweight Potential of Laser Additive Manufactured NiTi Triply Periodic Minimal Sheet Lattices

open access: yesAdvanced Engineering Materials, EarlyView.
This study explores the lightweight potential of laser additive‐manufactured NiTi triply periodic minimal surface sheet lattices. It systematically investigates the effects of relative density and unit cell size on surface quality, deformation recovery, compression behavior, and energy absorption.
Haoming Mo   +3 more
wiley   +1 more source

Influence of different final irrigation protocols for removal of photosensitizer activated by ultrasonic device on the bond strength of gutta-percha/bioceramic sealer and fiberglass posts/self-adhesive cement. [PDF]

open access: yesLasers Med Sci
Sanches Menchik VH   +9 more
europepmc   +1 more source

Laser Powder Bed Fusion of Copper–Tungsten Composites for Heat Sink Applications in High‐Power Electronics

open access: yesAdvanced Engineering Materials, EarlyView.
This article demonstrates the successful qualification of a copper–tungsten composite for laser powder bed fusion. The resulting components exhibited high density, high thermal conductivity, and reduced thermal expansion. Heat sinks with complex geometries were successfully manufactured, clearly showcasing the material's potential for additive ...
Simon Rauh   +6 more
wiley   +1 more source

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