Results 91 to 100 of about 474,399 (285)
Introduction to Recent Advances in Quality Assessment for Adhesive Bonding Technology
150The first chapter highlights the relevance of both adhesive bonding technology and in-process quality assessment for mastering twenty-first-century challenges in joining functional and lightweight materials like carbon fibre reinforced polymers.
Noeske, Paul Ludwig Michael +11 more
core +1 more source
Rapidly Solidified High‐Strength Invar 36 Prepared by Planar‐Flow Melt Spinning
The Invar 36 alloy was rapidly solidified using the planar‐flow melt‐spinning technique. Ribbon samples with thicknesses ranging from 20 to 160 mm were produced. As the grain size of the ribbon decreased to sub‐micron levels, the hardness increased by more than 2 times.
Bekir Akgül, Mehmet Kul
wiley +1 more source
This perspective reframes additive manufacturing for electrical machines as a qualification‐limited materials and architecture design problem. It links process–structure–property–performance relationships to magnetic, conducting, dielectric, and thermal property windows, highlighting where AM can enable segmented magnetic circuits, permanent magnet ...
Dénes Fodor, Loránd Szabó
wiley +1 more source
Supporting AI Readiness Through Digital Workflows in Materials Science
Digitalization drives innovation in materials science by connecting data silos and turning heterogeneous processes into reusable research pipelines. Across 13 MaterialDigital projects, digital workflows reveal complementary pathways toward AI‐ready materials research, founded on structured data, persistent artifacts, executable orchestration, and ...
Marian Bruns +67 more
wiley +1 more source
This study proposes a potential device design for joint cartilage replacement. Silica‐polytetrahydrofuran (SiO2‐PolyTHF) hybrids with customizable mechanical properties were developed to mimic the characteristics of a natural meniscus. These were synthesized through a two‐pot sol–gel hybrid process.
Yu‐Chien Lin +12 more
wiley +1 more source
The application of organic materials used in IC advanced packaging:A review
With the development of advanced technologies, the importance of semiconductor packaging has been further highlighted. To meet the increasing complexity and performance requirements of semiconductor devices, many integrated circuit (IC) advanced ...
Liu Jikang
doaj +1 more source
Rotary 3D Printing With Integrated Electroplating
A rotary material extrusion platform integrates localized copper electroplating with printing and encapsulation to fabricate cylindrical polymer–metal structures containing fully embedded, low‐resistance conductive pathways that enable internal Joule heating and thermally activated shape‐memory responses.
Antonio Zagaria +5 more
wiley +1 more source
PUF/ENB microcapsules were synthesized based on a sequential factorial design and incorporated into an epoxy matrix. Their anticorrosive action, associated with the self‐healing mechanism, demonstrated that the addition of microcapsules to the coating improved anticorrosive performance compared to pure epoxy coatings, particularly when the encapsulate ...
Vandicleya Alves Moreira +6 more
wiley +1 more source
Background High-concentration hydrogen peroxide bleaching can induce structural and compositional changes in enamel that adversely affect adhesive bonding. While delayed bonding after bleaching has been investigated, existing evidence is largely based on
Abida Saleem +5 more
doaj +1 more source
Experimental study of elastic and strength properties of adhesives
Adhesive bonding is widely used across various industrial sectors due to its unique properties, offering effective solutions to certain engineering challenges associated with other types of joints.
Oleksii Vambol +4 more
doaj +1 more source

