3. Fachtagung: Kleben von Kunststoffen und Metallen Tagungsunterlagen
At the conference in Halle, Germany, in December 2002, the following lectures were given: Introduction into adhesive bonding (G.Koetting); High-strength adhesive bonding of metals and plastics (B.Mayer); Adhesive bonding of metals and plastics in ...
Schweisstechnische Lehr- und Versuchsanstalt Halle GmbH (Germany)
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Kinetics‐Controlled Architecture of Binder‐Free Organic Electrodes for Enhanced Ion Transport
Pulse reverse electrodeposition controls nucleation and growth to create hierarchically porous Py‐derived oligomeric electrodes with enhanced ionic accessibility and reduced transport resistance. The resulting binder‐free architectures translate these transport advantages into practical sodium‐storage functionality.
Satendra Kumar +1 more
wiley +1 more source
Factors Influencing Adhesive Bonding Efficiency in ETICS Application. [PDF]
Gaciek P, Gaczek M, Krause P.
europepmc +1 more source
A sequential dual‐alignment strategy independently programs the orientation of conductive metal‐organic framework (c‐MOF) microrods and liquid crystals within a composite film. This approach creates an asymmetric bilayer structure that enables precise, multi‐responsive actuation.
Taegyun Hong +5 more
wiley +1 more source
Marginal microleakage at the adhesive bonding interface submitted to storage in water, chemical aging or thermocycling. [PDF]
Fagundes PIDG, Caldas RA, Consani RLX.
europepmc +1 more source
Influence of the β- Radiation/Cold Atmospheric-Pressure Plasma Surface Modification on the Adhesive Bonding of Polyolefins. [PDF]
Bednarik M +6 more
europepmc +1 more source
Preferential Interfacial Engineering of Hydrogels via Interdigitated Nanoparticle Assembly
Robust surface functionalization of hydrogel surfaces is performed via interdigitated metal nanoparticle assembly, inducing strong affinity with the hydrogel matrix. The partially exposed nanoparticle domains act as interfacial nanobridges that mediate both chemical and physical bonding with diverse materials, including small molecules, fluorous ...
Hyeonjin Kim +11 more
wiley +1 more source
Effect of Adhesive Bonding Process Parameters on the Joint Quality of the Middle Layer in Floorboards. [PDF]
Kujawińska A +3 more
europepmc +1 more source
Physics‐Grounded Materials Artificial Intelligence for Reliable Materials Discovery
Physics‐Grounded Materials AI (PhysMat AI) integrates physical priors, descriptors, constraints, verification, and data infrastructure into a unified full‐stack framework, enabling reliable, interpretable, and autonomous AI‐driven materials discovery.
Yuhang Wang +3 more
wiley +1 more source
Flow Reactor for Sustainable Electrosynthesis Fabricated via Cost-Effective Electroplating and Adhesive Bonding. [PDF]
Song CH, Jeong H, Cha YL, Park CP.
europepmc +1 more source

