Results 131 to 140 of about 300,222 (224)
The properties of colloidal systems. —II. On adsorption as preliminary to chemical reaction [PDF]
, 1911 William Maddock Bayliss
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Advanced Functional Materials, EarlyView.Oxygen‐doping modulated g‐C3N4 support enables a strong built‐in electric field (BIEF) in FeOCl‐OCN.This enhanced BIEF induces the rearrangement of Fe(II)/Fe(III) in FeOCl, which subtly improves intermediates adsorption and also reduces the energy barrier of *O production, thereby achieving efficient PMS activation with 1O2 and Fe(IV)= O as the primary
Ying Zeng +9 more
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Retracted: Removal of Safranin-T and Toluidine from Water through Gum Arabic/Acrylamide Hydrogel
Adsorption Science & Technology, 2023 Adsorption Science and Technology
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The influence of hydrogen ion concentration on the adsorption of weak electrolytes by pure charcoals
, 1929 Harold John Phelps, Rudolph Peters
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Advanced Functional Materials, EarlyView.This study examines the surface characteristics of AlInP (001), crucial for advanced solar cells and photoelectrochemical devices. Using theoretical modeling and experiments, it identifies how phosphorus‐rich and indium‐rich surfaces create mid‐gap states that pin the Fermi level and influence ultrafast electron dynamics.
Mohammad Amin Zare Pour +11 more
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The Adsorption of Non-polar Gases on Alkali Halide Crystals. V. The Low-temperature Adsorption of Non-polar Gases on Cubic Potassium Bromide [PDF]
, 1957 Teruo Hayakawa
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Advanced Functional Materials, EarlyView.The separation of Helium gas from natural gas is challenging but highly important. MIL‐116(Ga), a “non‐porous” metal–organic framework is used as a molecular sieve to separate He from CH4. Druse‐like MIL‐116(Ga) particles are integrated into polysulfone mixed matrix membranes.
Ayisha Komal +10 more
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Carbon Nanotube 3D Integrated Circuits: From Design to Applications
Advanced Functional Materials, EarlyView.As Moore's law approaches its physical limits, carbon nanotube (CNT) 3D integrated circuits (ICs) emerge as a promising alternative due to the miniaturization, high mobility, and low power consumption. CNT 3D ICs in optoelectronics, memory, and monolithic ICs are reviewed while addressing challenges in fabrication, design, and integration.
Han‐Yang Liu +3 more
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