Results 221 to 230 of about 5,186,108 (295)

Author Correction: Far-field phonon coupling in valley metamaterial circuits. [PDF]

Nat Commun
Huang Y, Yuan W, Guo Z, Wang Q, Zhang Y, Zhou Y, Pan Y, Zhou J, Wright OB, Zhong Z, Zhao J.   +10 more
europepmc   +1 more source

Monolayer MoS2 With Ultrahigh Piezoelectricity: From ALD Dose Control to Device Performance

Advanced Science, EarlyView.
This study demonstrates that controlling precursor dosages in atomic layer deposition (ALD) serves to regulate ultrathin oxide quality, which in turn determines sulfurization behavior and MoS2 monolayer continuity. The resulting continuous, low‐defect monolayers enable improved piezoelectric performance and support a flexible slippage sensor, linking ...
Yun Li, Ming Rui Joel Tan, Subhasis Das, Yafei Du, Wenjie Lai, Jiamin Amanda Ong, Yongli He, Yiming Zou, Anatoli Kurkin, Peiwen Huang, Jiajun Liu, Xingyu Chen, Alfred Iing Yoong Tok, Soo Jay Phee, Lioz Etgar, Shlomo Magdassi, Pooi See Lee   +16 more
wiley   +1 more source

Rheological Behavior and Processing of High-Performance Engineering Polymers. [PDF]

Polymers (Basel)
Rahman MH, Haque ME, Shatnawi Z, Arifuzzaman M, Martuza MA, Al-Ahmed A.   +5 more
europepmc   +1 more source

Surface Neuronal‐Like Structuring of High‐Strength CFRP for Enhanced Electromagnetic Interference Shielding

Advanced Science, EarlyView.
This study elucidates the microstructural evolution at the material interface of Ni‐plated plain‐weave carbon fiber fabric following vacuum heat treatment at 500°C–900°C under different current densities, as well as the mechanism underlying the synergistic enhancement of electromagnetic shielding and ductility.
Wei Cheng, Ben Jia, Shuhan Xiang, Biao Chen, Yongjun Zhang, Zhuo Liu, Xiaopeng Wan, Heyuan Huang   +7 more
wiley   +1 more source

Integrated Multi-Criteria Decision-Making for the Selection of Natural and Synthetic Fiber-Reinforced Composites for Unmanned Aerial Vehicle Micro-Turbojet Engine Inlets. [PDF]

Polymers (Basel)
Gherissi A.
europepmc   +1 more source

Additive Manufacturing of High‐Performance Polymers for Extreme Environments

Advanced Science, EarlyView.
Additive manufacturing of high‐performance polymers for extreme environments is critically reviewed through an integrated chemistry‐processing‐structure‐property‐qualification framework. The review compares fused filament fabrication, selective laser sintering, and direct ink writing, linking rheology and thermal history to crystallization, defect ...
Md Tofazzal Hossain, Mohammed Intishar Nur, Md Shajedul Hoque Thakur, Indranil Dey, Md Mesbahul Maruf, Md Jahid Hasan, Suryasarathi Bose, Muhammad M. Rahman   +7 more
wiley   +1 more source

Biomimetic and Bioinspired Materials: Design Strategies, Mechanical Properties, and Engineering Applications-A Review. [PDF]

Glob Chall
Karuppusamy M, Palanisamy S, Gurusamy M, Balasubramanian VP, Jayamani M, Sankar SL, Sundararajan K, Sivanantham G, Ali SK, Palaniappan M, Belay M, Abbas M.   +11 more
europepmc   +1 more source

Freestanding Hierarchical‐Porous BCZT Thin Films Enable Efficient Ultrasonic Energy Harvesting in Soft Tissue

Advanced Science, EarlyView.
Freestanding hierarchical‐porous BCZT thin films integrate a compliant porous surface with a dense piezoceramic backbone to balance mechanical reliability, voltage sensitivity, and acoustic coupling. The films enable stable wearable pulse‐wave monitoring and enhanced tissue‐coupled ultrasonic energy harvesting, offering a promising route toward soft ...
Zifan Li, Shengwei Gao, Wang Hong, Yuxin Chen, Yiyang Gu, Xu Wang, Chen Tang, Ying Hong, Xuemu Li, Xiaodong Yan, Yi Zheng, Yiming Liu, Junchen Liao, Biao Wang, Shiyuan Liu   +14 more
wiley   +1 more source

Dynamic Similarity Theory Based on Geometric Distortion and Material Compensation for On-Orbit Assembled Space Rod Structures. [PDF]

Materials (Basel)
Ye Y, Wang S, Yang J, Zhang D, Ma X.
europepmc   +1 more source

Ultrahigh Interfacial Thermal Conductance across GaN/BAs Interfaces via Atomic‐Level Engineering

Advanced Science, EarlyView.
The integration of gallium nitride (GaN) with ultrahigh‐thermal‐conductivity boron arsenide (BAs) substrates represents a promising pathway for developing next‐generation high‐power devices. The heat dissipation capability of such integrated systems is fundamentally governed by thermal transport across GaN/BAs interfaces, and buffer layers such as ...
Linfeng Yu, Hongkai Zhang, Haofeng Qin, Yi Zhang, Jinyuan Xu, Yiming Zhao, Dongliang Ding, Jianbin Xu, Sunmi Shin, Zhuhua Zhang, Guangzhao Qin   +10 more
wiley   +1 more source