Results 231 to 240 of about 90,867 (329)
Risk Factor Assessment and Predictive Modeling for Ventilator-Associated Pneumonia: Design and Clinical Implementation of an Artificial Intelligence-Enhanced Early Detection Framework Using Multisource Data Analytics. [PDF]
Zhang J +11 more
europepmc +1 more source
This study combines full‐field tomography with diffraction mapping to quantify radial (ε002$\varepsilon _{002}$) and axial (ε100$\varepsilon _{100}$) lattice strain in wrinkled carbon‐fiber specimens for the first time. Radial microstrain gradients (−14.5 µεMPa$\varepsilon \mathrm{MPa}$−1) are found to signal damage‐prone zones ahead of failure, which ...
Hoang Minh Luong +7 more
wiley +1 more source
AI-powered platform revolutionizing blood cell morphology education for medical students. [PDF]
Liu X +6 more
europepmc +1 more source
Efficient n‐Doping of Organic Semiconductors via a Broadly Applicable Nucleophilic‐Attack Mechanism
A novel n‐doping mechanism for organic semiconductors (OSCs) is revealed, based on a nucleophilic‐attack reaction. Using n‐Butyl lithium (n‐BuLi) as a model dopant, this strategy achieves exceptionally high conductivity in C60 and PC61BM. The mechanism is broadly applicable to various OSCs and other nucleophilic dopants, establishing a new chemical ...
Huan Wei +16 more
wiley +1 more source
Mimicking Alveolar Lung Structures with Lattice Designs. [PDF]
Riccio A +5 more
europepmc +1 more source
An Ir‐based reversible copper electrodeposition variable‐emissivity device achieved over 8000 cycles with just 11% radiative temperature variation decay. This stability stems from Ir's inherent inertness, high conductivity, and strength, which collectively suppress cracking and corrosion.
Runyun He +11 more
wiley +1 more source
Simulated microgravity induces time-dependent enhancement of <i>Pseudomonas aeruginosa</i> biofilm formation. [PDF]
Zhang W +9 more
europepmc +1 more source
Three‐Dimensional Heterogeneous Bonding for High‐Density and Low‐Noise TMR Sensing Arrays
This study demonstrates a three‐dimensional heterogeneous bonding approach to fabricate compact TMR sensing units with double junction numbers and improved magnetic performance. Optimized Au─Au bonding and angled etching improve device integrity, noise characteristics, and magnetoresistance.
Zi'ang Han +3 more
wiley +1 more source

