Results 231 to 240 of about 90,867 (329)

Microscale Mapping of Fiber Strain and Damage in Composite Wrinkled Laminates Using Computed Tomography Assisted Wide‐Angle X‐Ray Scattering

open access: yesAdvanced Science, EarlyView.
This study combines full‐field tomography with diffraction mapping to quantify radial (ε002$\varepsilon _{002}$) and axial (ε100$\varepsilon _{100}$) lattice strain in wrinkled carbon‐fiber specimens for the first time. Radial microstrain gradients (−14.5 µεMPa$\varepsilon \mathrm{MPa}$−1) are found to signal damage‐prone zones ahead of failure, which ...
Hoang Minh Luong   +7 more
wiley   +1 more source

Efficient n‐Doping of Organic Semiconductors via a Broadly Applicable Nucleophilic‐Attack Mechanism

open access: yesAdvanced Science, EarlyView.
A novel n‐doping mechanism for organic semiconductors (OSCs) is revealed, based on a nucleophilic‐attack reaction. Using n‐Butyl lithium (n‐BuLi) as a model dopant, this strategy achieves exceptionally high conductivity in C60 and PC61BM. The mechanism is broadly applicable to various OSCs and other nucleophilic dopants, establishing a new chemical ...
Huan Wei   +16 more
wiley   +1 more source

Mimicking Alveolar Lung Structures with Lattice Designs. [PDF]

open access: yesPolymers (Basel)
Riccio A   +5 more
europepmc   +1 more source

Electrode Engineering for High‐Durability Variable‐Emissivity Devices Based on Reversible Copper Electrodeposition

open access: yesAdvanced Science, EarlyView.
An Ir‐based reversible copper electrodeposition variable‐emissivity device achieved over 8000 cycles with just 11% radiative temperature variation decay. This stability stems from Ir's inherent inertness, high conductivity, and strength, which collectively suppress cracking and corrosion.
Runyun He   +11 more
wiley   +1 more source

Simulated microgravity induces time-dependent enhancement of <i>Pseudomonas aeruginosa</i> biofilm formation. [PDF]

open access: yesCurr Res Microb Sci
Zhang W   +9 more
europepmc   +1 more source

Three‐Dimensional Heterogeneous Bonding for High‐Density and Low‐Noise TMR Sensing Arrays

open access: yesAdvanced Science, EarlyView.
This study demonstrates a three‐dimensional heterogeneous bonding approach to fabricate compact TMR sensing units with double junction numbers and improved magnetic performance. Optimized Au─Au bonding and angled etching improve device integrity, noise characteristics, and magnetoresistance.
Zi'ang Han   +3 more
wiley   +1 more source

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