Results 81 to 90 of about 351,811 (290)
Advanced Materials, EarlyView.The study reports a DNA/RNA heteroduplex hydrogel (SeroPTEN‐CG) that undergoes DNase‐mediated hydrogel‐to‐nanogel transition for spinal cord injury therapy by targeting the serotonergic system, combining 5‐hydroxytryptamine (5‐HT)‐mediated excitability restoration to reactivate dormant interneurons with phosphatase and tensin homolog (PTEN)‐targeted ...
Chunlin Li +19 more
wiley +1 more source
Multifocal osteonecrosis in systemic lupus erythematosus: Two case reports and literature review
European Journal of Rheumatology, 2021 Vicenç Torrente-Segarra, Maria Bonet
doaj +1 more source
Advanced Materials Interfaces, EarlyView.Spin‐coated films of the conjugated polymer F8T2 (poly (9,9‐dioctylfluorene‐alt‐bithiophene)) generate superoxide at the film‐medium interface, enabling precise delivery of reactive oxygen species (ROS) as visible‐light “ROS patches.” Coated surfaces drive rapid, localised cytotoxicity in MCF7 cancer monolayers under white light, providing a reagent ...
Joe Kaye +8 more
wiley +1 more source
jung sieht alt, alt sieht jung
DIE Zeitschrift für Erwachsenenbildung, 2008 Hauf, Chris +4 more
openaire +3 more sources
Mechanical properties and morphology of HDPE/PA12 blends compatibilized with HDPE-alt-MAH [PDF]
, 2022 Geovane de Almeida Santos da Silva +1 more
openalex +1 more source
Photonic Crystal Enhanced Microscopy on a 2D Photonic Crystal Surface
Advanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.This work demonstrates the design, fabrication, and the first‐time test of a 2D photonic crystal surface for photonic resonator absorption microscopy. The designed surface uniformly enhances electromagnetic near fields, achieving > 100% improved detecting uniformity for surface‐captured AuNPs from a blocking biosensor assay aimed for detecting SARS‐CoV‐
Weinan Liu +5 more
wiley +1 more source
Advancements in TLP Bonding for Power Electronics Die‐Attach Applications
Advanced Materials Technologies, EarlyView.Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal +4 more
wiley +1 more source