Results 191 to 200 of about 631,740 (304)

Ti3C2Tx MXene/Silver Composite Foams For Lightweight, High‐Performance Electromagnetic Interference Shielding and Joule Heating

open access: yesAdvanced Materials Interfaces, EarlyView.
Ultrathin MXene/EMF composite foams achieve a specific shielding efficiency of 749.6 dB.dB·cm3$\mathrm{dB}\cdot {\mathrm{cm}}^{3}$/g, while the silver‐enhanced MXene/Ag/EMF reaches 81.4 dB shielding effectiveness at just 1.0 mm thickness. Both composites exhibit rapid Joule heating, retain stability up to 250∘C$^\circ{\rm C}$, and withstand 1000 ...
Abdullah A. Mahmood   +7 more
wiley   +1 more source

Analytical Study of Temperature Fields in Aluminum Alloy Castings During Solidification in Sand and Metal Molds. [PDF]

open access: yesMaterials (Basel)
Liutyi R   +5 more
europepmc   +1 more source

Processing‐Induced Performance Limits of Platinum Resistance Temperature Detectors for Reliable Organ‐On‐A‐Chip Sensing

open access: yesAdvanced Materials Interfaces, EarlyView.
The thermal budget imposed during oxide passivation is revealed as a key design parameter for Pt resistance temperature detectors in Organ‐on‐a‐Chip platforms. By establishing a direct processing–microstructure–device performance relationship, this work transforms an unavoidable fabrication step into a strategy for reliable integrated temperature ...
Gabriel M. Ferreira   +4 more
wiley   +1 more source

Recent Advances in Plasma‐Enhanced Atomic Layer Etching for Next‐Generation Nanofabrication

open access: yesAdvanced Materials Interfaces, EarlyView.
Continued semiconductor miniaturization demands atomic‐scale patterning and ultralow surface roughness beyond the capabilities of conventional reactive ion etching. This review highlights advances in isotropic and anisotropic plasma‐enhanced atomic layer etching since 2020, covering fundamental mechanisms, applications across major semiconductor ...
Shih‐Nan Hsiao
wiley   +1 more source

Thermoplastic Dielectric Coatings for Flexible Electrodynamic Dust Shields: Structural and Functional Performance

open access: yesAdvanced Materials Interfaces, EarlyView.
Thermoplastic attachment is introduced as a scalable surface coating strategy to improve the durability and dielectric reliability of flexible electrodynamic dust shields. By embedding chemically modified reduced graphene oxide (CMrGO) electrodes within thermoplastic laminates, mechanical degradation, abrasion damage, and vacuum‐induced electrical ...
Ide E. Onal   +6 more
wiley   +1 more source

Band Alignment of Grafted Si/Ge0.89Sn0.11 Heterojunction Determined by X‐Ray Photoelectron Spectroscopy

open access: yesAdvanced Materials Interfaces, EarlyView.
ABSTRACT We investigate the band alignment of a monocrystalline grafted p‐type Si/Ge0.89Sn0.11 heterostructure using X‐ray photoelectron spectroscopy (XPS). The bandgap of the Ge0.89Sn0.11 epilayer of 0.50 eV was first determined and cross‐verified using photoluminescence spectroscopy, infrared transmission, and theoretical calculation.
Yang Liu   +11 more
wiley   +1 more source

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