Results 181 to 190 of about 147,554 (292)

DIY Arduino calorimeter: Converting commercial thermally insulated coffee-cups into precision isobaric calorimeters. [PDF]

HardwareX
Bentancor M, Ávila M, Maccio S, Méndez E.   +3 more
europepmc   +1 more source

Tailoring K+/Vacancy Disordered Layered Oxide via Charge Engineering for Stabilizing High‐Performance Potassium‐Ion Batteries

Advanced Functional Materials, EarlyView.
With a charge‐ion coupling engineering strategy, a K+/vacancy disordered K0.5Mn0.8Co0.1Ti0.1O2 material has been designed. The targeted transition metal doping disrupts charge ordering and inducing K+/vacancy disordering, thereby enabling rapid K+ diffusion through interconnected channels and a stable solid‐solution reaction mechanism.
Yongfeng Jia, Xuanpeng Wang, Jiashen Meng, Lujun Zhu, Fanjie Xia, Hong Wang, Fang Liu, Xiao Zhang, Quanquan Pang, Jian Wang, Zhitong Xiao   +10 more
wiley   +1 more source

A Fully Integrated Monolithic Monitor for Aging-Induced Leakage Current Characterization. [PDF]

Sensors (Basel)
Darko EN, Karimpour S, Adjei D, Tamakloe K, Chen D.   +4 more
europepmc   +1 more source

Swelling‐Programmed Topographical Guidance for Dynamic Spheroid Self‐Assembly via a Mechanochemical Hydrogel Niche

Advanced Functional Materials, EarlyView.
A swelling‐programmed micropatterned hydrogel guides adherent cells through a controlled transition from cell–matrix anchoring to cadherin‐mediated cell–cell compaction, enabling rapid assembly of high‐viability spheroids with defined size and morphology.
Han Gyeol Nam, Seon Yeong Chae, Young Woo Kwon, Hye Jin Heo, Hye Rin Lee, Ji Hyeok Lee, Dong‐Wook Han, Yun Hak Kim, Suck Won Hong   +8 more
wiley   +1 more source

Auxeticity‐by‐Assembly: Interlocking Modular Auxetic Metamaterials with Selectively Activatable AgNW–Graphene Oxide‐EGaIn Composite Interconnects for Scalable Freeform Photovoltaic Modules

Advanced Functional Materials, EarlyView.
Auxeticity‑by‑Assembly converts freeform photovoltaics from cut‑defined layouts to assembly‑defined systems. Standardized interlocking units generate negative‑Poisson‑ratio, reconfigurable architectures, while hinge regions are wired by selectively activatable AgNW–GO@EGaIn composite interconnects and a folding‑enabled interconnector layer. A decimeter‑
Seok Joon Hwang, Jiwon Ryu, Dae‐Hee Cho, YoungHoi Cho, Yewon Hwang, Haram Lee, Dong Hoe Kim, Byeong‐Kwon Ju, Seok Chung, Deokjae Choi, Gee Yeong Kim, Heesuk Jung, Taehee Kim, Hyeonggeun Yu, Gabseok Seo, Phillip Lee   +15 more
wiley   +1 more source

Accelerating hybrid XOR-CNF Boolean satisfiability problems natively with in-memory computing. [PDF]

Nat Commun
Im H, Böhm F, Pedretti G, Kushida N, Noori M, Valiante E, Zhang X, Yang CW, Bhattacharya T, Sheng X, Ignowski J, Heittmann A, Strachan JP, Mohseni M, Beausoleil R, Vaerenbergh TV, Rozada I.   +16 more
europepmc   +1 more source

Multi‐Scale Interface Engineering of MXenes for Multifunctional Sensory Systems

Advanced Functional Materials, EarlyView.
MXenes, as two‐dimensional transition metal carbides and nitrides, demonstrate remarkable capabilities for multifunctional sensing applications. This review systematically examines multi‐scale interface engineering approaches that enhance sensing performance, enable diverse detection functionalities, and improve system‐level compatibility in MXene ...
Jiaying Liao, Sin‐Yi Pang, Jianhua Hao
wiley   +1 more source

A multi-client web platform for telemetry of the mechanical properties of material. [PDF]

HardwareX
Ivanov O, Shulgin V, Popovych N, Bondar L.   +3 more
europepmc   +1 more source

Atomic Layer Deposition in Transistors and Monolithic 3D Integration

Advanced Functional Materials, EarlyView.
Transistors are fundamental building blocks of modern electronics. This review summarizes recent progress in atomic layer deposition (ALD) for the synthesis of two‐dimensional (2D) metal oxides and transition‐metal dichalcogenides (TMDCs), with particular emphasis on their enabling role in monolithic three‐dimensional (M3D) integration for next ...
Yue Liu, Taoyu Zou, Cheng‐Yan Xu, Liang Zhen, Yang Li, Yong‐Young Noh   +5 more
wiley   +1 more source

Editorial: Algorithm-hardware co-optimization in neuromorphic computing for efficient AI. [PDF]

Front Neurosci
Yousefzadeh A, Patiño-Saucedo A, Croon G, Sifalakis M.   +3 more
europepmc   +1 more source