Results 201 to 210 of about 117,427,695 (333)
Laser‐Induced Local De‐Doping in Organic Semiconductors
The polymer PBTTT‐C14 doped with the small molecule acceptor F4TCNQ is considered as a benchmark material system. Mask‐free, microscale patterning of the doping level via laser‐induced heating and sublimation of dopant molecules is shown. Controlling laser irradiance and swath spacing allows dopant level control with laser‐limited resolution, opening ...
Christian Rainer +5 more
wiley +1 more source
Dense tactile streams from across the humanoid body converge on collide in a central wiring and data bottleneck. By relocating computation closer to and then into the skin itself, near‐ and in‐sensor architectures, together with neuromorphic computing, chart a path toward perception‐native electronic skin, in which the conversion of stimulus into ...
Mijin Kim +6 more
wiley +1 more source
An Energy-Efficient LiDAR Receiver Using Time-to-Voltage Converter and SAR ADC in 180 nm CMOS. [PDF]
Seo B, Park SM.
europepmc +1 more source
Vertically oriented van der Waals MoS2 thin films enable a mechanically programmable crack network for strain sensing. The initial mechanical programming protocol establishes a programmed crack configuration along weak interlayer and interdomain interfaces.
Yinli Wang, Hiroyuki Hirakata
wiley +1 more source
The Road to a Linked Data Paradise-Identifying the Barriers From the Experimentalist's Perspective. [PDF]
Nylund IE, Lai SY.
europepmc +1 more source
Hierarchically Wrinkled Silver Ink as a Platform for Fully Integrated Stretchable Electronic Systems
Silver Hierarchical Responsive ink (SHRink), a universal approach for the fabrication of highly stretchable interconnects, wirings, and skin‐interfaced electrodes, is realized through low‐cost, scalable spray‐printing and transfer‐printing. The SHRink demonstrates high electrical conductivity (1.2E04 S cm−1) and large stretchability (235% max fracture ...
Junye Li +11 more
wiley +1 more source
Signal averaging in cryogenic fast-field-cycling NMR experiments. [PDF]
Jurkutat M +3 more
europepmc +1 more source
This review presents multidimensional heat‐path engineering for thermal interface materials, showing how internal heat transport, interfacial contact and bondline formation, and processing‐defined pathway architectures together determine bonded‐joint thermal performance.
Jinsoo Na +7 more
wiley +1 more source
An Observer-Data-Path Decoupled Time-Domain ADC with Three-Stage Digital Background Calibration in 28 nm CMOS. [PDF]
Qin C, Liu B, Wang R, Li L, Zhang C.
europepmc +1 more source
Copper electroplating transforms lightweight 3D‐printed TPMS polymer lattices into effective electromagnetic shields. Topology, relative density, and conductive seed layer continuity govern copper penetration, electrical resistance, and attenuation. SEA consistently exceeds SER, while 35% RD Diamond lattice gives the best performance, reaching 48.72 dB
Aman Al Khatib +6 more
wiley +1 more source

