Low-temperature, vacuum-free deposition of N-DMBI-H enables high conductivities in organic semiconductors. [PDF]
Ferrari F, Pokerznik O, Koster LJA.
europepmc +1 more source
The perspective presents an integrated view of neuromorphic technologies, from device physics to real‐time applicability, while highlighting the necessity of full‐stack co‐optimization. By outlining practical hardware‐level strategies to exploit device behavior and mitigate non‐idealities, it shows pathways for building efficient, scalable, and ...
Kapil Bhardwaj +8 more
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Testing the Material Time Concept in Nanoconfined Glasses: Equilibration Kinetics of 5PPE in Nanopores. [PDF]
Pytlik Z +4 more
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Anion‐exchange doping of conjugated polymers is an effective way to achieve high conductivities. Here, we report over 2000 S cm−1 electrical conductivity for doped P(g3BTTT). In addition, we show that P(g3BTTT) sustains exceptionally high doping levels without any drop in the charge mobility.
Basil Hunger +14 more
wiley +1 more source
High-temperature electrical performance and interface adhesion performance of SiC-based Pt thin-film RTDs. [PDF]
Fang Z +9 more
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Organic Materials of Tomorrow: Horizons of Artificial Intelligence
This review examines machine learning techniques accelerating the discovery of organic semiconductors by linking molecular structure to properties. Key methods include graph neural networks, generative models, and active learning. Applications to organic photovoltaics demonstrate practical impact.
Harold Mena +3 more
wiley +1 more source
Advances in Se Wide-Bandgap Photovoltaics and Te<sub>x</sub>Se<sub>1-x</sub> SWIR Photodiodes. [PDF]
Alfieri AD, Jariwala D.
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Human RPL7 and DDX21 function synergistically with HTLV-1 Gag to overcome genomic RNA structural barriers that block tRNAPro primer annealing. [PDF]
Syu YC, Long Z, Musier-Forsyth K.
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High-Birefringence Photoalignable Polymeric Films via <i>In Situ</i> Mesogenic Modification. [PDF]
Kawatsuki N +5 more
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Microscopic Mechanism of Glass Surface Activation, Annealing and Etching on Glass-Ti/Cu Interfacial Adhesion. [PDF]
Shi T +8 more
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