Results 151 to 160 of about 206,710 (314)
A novel method for the production of highly adherent Au layers on glass substrates used in surface plasmon resonance analysis: substitution of Cr or Ti intermediate layers with Ag layer followed by an optimal annealing treatment [PDF]
Mohammad Ghorbanpour, Cavus Falamaki
openalex +1 more source
Halide Perovskite Radiation Detectors: Conventional Imaging Applications and New Opportunities
Organic–inorganic hybrid halide perovskite (OIHP) semiconductors, owing to their exceptional optoelectronic properties, are emerging as promising next‐generation integrated radiation detectors for applications in medical radiodiagnosis and healthcare monitoring.
Dou Zhao +4 more
wiley +1 more source
Design and Applications of Multi‐Frequency Programmable Metamaterials for Adaptive Stealth
This article provides a comprehensive overview of metamaterials, including their fundamental principles, properties, synthesis techniques, and applications in stealth, as well as their challenges and future prospects. It covers topics that are more advanced than those typically discussed in existing review articles, while still being closely connected ...
Jonathan Tersur Orasugh +4 more
wiley +1 more source
Simulated Annealing with Tsallis Weights for ±J Spin Glass
J. S. Kłos, S. Kobe
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Riuzo Koyama, Muneo Watanabe
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This review highlights recent advances in label‐free optical biosensors based on 2D materials and rationally designed mixed‐dimensional nanohybrids, emphasizing their synergistic effects and novel functionalities. It also discusses multifunctional sensing platforms and the integration of machine learning for intelligent data analysis.
Xinyi Li, Yonghao Fu, Yuehe Lin, Dan Du
wiley +1 more source
Annealing Behavior of Emission Bands Induced by Neutron Irradiation in Silica Glass.
Shōichi Nasu +7 more
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Device Integration Technology for Practical Flexible Electronics Systems
Flexible device integration technologies are essential for realizing practical flexible electronic systems. In this review paper, wiring and bonding techniques critical for the industrial‐scale manufacturing of wearable devices are emphasized based on flexible electronics.
Masahito Takakuwa +5 more
wiley +1 more source

