Results 251 to 260 of about 1,452,791 (344)

Ferromagnetic Interlayer Exchange Coupling in Magnetic Topological Insulator Sandwich Heterostructures

open access: yesAdvanced Science, EarlyView.
A thin topological insulator (Bi2Te3) inserted between two single magnetic septuple layers of MnBi2Te4 is shown to convert the intrinsic antiferromagnetic interlayer coupling into robust ferromagnetism. As the Bi2Te3 spacer thickness increases from 1 to 4 quintuple layers, the weakening coercivity, Curie temperature, and interlayer coupling reveal ...
Enayet Hossain   +10 more
wiley   +1 more source

The $b \to sl^+ l^{-1}$ Anomalies And Their Implications For New Physics [PDF]

open access: green, 2016
Sébastien Descotes–Genon   +3 more
openalex  

A Clarification on Quantum‐Metric‐Induced Nonlinear Transport

open access: yesAdvanced Science, EarlyView.
How does the quantum metric truly govern the nonlinear transport? The longstanding theoretical discrepancies are resolved in quantum‐metric‐induced nonlinear transport and the correct intrinsic nonlinear conductivity is identified. Furthermore, a toy model is engineered to suppress the competing effects, uniquely highlighting the role of quantum metric
Xiao‐Bin Qiang   +4 more
wiley   +1 more source

A Closed‐Loop‐Capable Neural Interface Platform for Deep Brain Modulation via Integrated Non‐Viral Gene Delivery, NIR Optogenetics, and Electrophysiological Recording

open access: yesAdvanced Science, EarlyView.
A multifunctional, 3D porous neural interface combines non‐viral gene delivery and NIR optogenetics to enable minimally invasive, closed‐loop modulation of deep‐brain circuits. Abstract Closed‐loop neuromodulation requires precise, stable, and cell‐specific control of neural circuits with minimal invasiveness.
Chao‐Yi Chu   +14 more
wiley   +1 more source

A Sustainable Adhesive Paradigm: Reversibly Reinforcing, Heat‐Free Bonding with Universal Substrates

open access: yesAdvanced Science, EarlyView.
A heat‐free adhesive system, delivering superior adhesion strength across metal, plastic, and glass substrates, is developed. Repeatable bonding with reinforcement instead of strength reduction enables error‐tolerant applications. This design paradigm establishes an eco‐friendly alternative to conventional adhesives, particularly suitable for ...
Shuang Zhang   +5 more
wiley   +1 more source

Home - About - Disclaimer - Privacy