Results 261 to 270 of about 1,957,816 (358)

Scalable Wheat Bran‐Algae Composites for Edible Electronics with Spray‐Coated Food‐Grade Conductive Inks

open access: yesAdvanced Electronic Materials, EarlyView.
A fully edible wheat bran–algae substrate is fabricated through scalable mould‐compression and spray‐coating, enabling robust, food‐grade platforms for sustainable electronics. A chitosan barrier improves water resistance and ink compatibility, while activated‐carbon conductive films form uniform electrodes with Ohmic behaviour.
Jaz Johari   +7 more
wiley   +1 more source

Epitaxial Growth of p‐Type β‐Ga2O3 Thin Films and Demonstration of a p–n Diode

open access: yesAdvanced Electronic Materials, EarlyView.
This study demonstrates p‐type conductivity in β‐Ga2O3 via Te–Mg co‐doping using MOCVD. The films show tunable hole concentrations up to 1.78×1017 cm−3, and a fabricated p–n diode exhibits rectifying behavior. Density functional theory reveals that Te introduces an intermediate band, lowering the Mg acceptor ionization energy and enabling p‐type ...
Chuang Zhang   +2 more
wiley   +1 more source

Development of a blood test for uterine sarcoma-Diagnosis and monitoring (DOORS-D and DOORS-M) studies. [PDF]

open access: yesPLoS One
Casey A   +9 more
europepmc   +1 more source

Embedded Direct‐Written Organic Micro‐TEGs for High‐Efficiency Skin‐Heat Harvesting

open access: yesAdvanced Electronic Materials, EarlyView.
A finite‐element–guided design of direct‐written organic micro‐thermoelectric generators is presented for efficient skin‐heat harvesting. Embedding PEDOT:PSS/PBFDO thermoelectric legs within flexible substrates suppresses interfacial heat losses and enhances vertical heat flow.
Milad Jabri   +4 more
wiley   +1 more source

Emerging Memory and Device Technologies for Hardware‐Accelerated Model Training and Inference

open access: yesAdvanced Electronic Materials, EarlyView.
This review investigates the suitability of various emerging memory technologies as compute‐in‐memory hardware for artificial intelligence (AI) applications. Distinct requirements for training‐ and inference‐centric computing are discussed, spanning device physics, materials, and system integration.
Yoonho Cho   +6 more
wiley   +1 more source

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