Results 241 to 250 of about 22,322 (302)

Advanced Optical Integration Processes for Photonic‐Integrated Circuit Packaging

open access: yesAdvanced Materials Technologies, EarlyView.
Photonic integrated chip packaging is a growing technology that helps make devices faster, more efficient, and more compact by using light instead of electricity. This review highlights recent progress in making these chips work better at different levels, discusses current challenges like heat and alignment, and looks at future possibilities for ...
Keuntae Baek   +4 more
wiley   +1 more source

Unraveling the Effects of Improved Cooling and Bias Force in the Actuation of a Shape‐Memory Soft Multimaterial Gripper

open access: yesAdvanced Materials Technologies, EarlyView.
This study examines a soft gripper with a NiTiCu6 Shape Memory Alloy (SMA) wire embedded in a graphene nanoparticle (GNP)‐functionalized PDMS matrix. Comparing GNP‐enhanced and plain elastomer prototypes, results show that GNPs improve cooling rates, accelerating release by 40%, but increase energy consumption in low‐current activations.
Fabio Lazzari   +5 more
wiley   +1 more source

Dual Resonant Plasmonic Infrared Pixels for Selective Optical Encoding

open access: yesAdvanced Materials Technologies, EarlyView.
This study presents dual‐resonant plasmonic nanostructures for advanced optical encoding in the mid‐infrared. By optimizing plasmonic resonances in nano‐antennas within ring cavities, selective and simultaneous tunability in both the MWIR and LWIR regions is achieved.
Goekalp Engin Akinoglu   +4 more
wiley   +1 more source

Miniaturized Devices for On‐the‐Spot Generation of Small‐Diameter Vascular Grafts

open access: yesAdvanced Materials Technologies, EarlyView.
An intracorporeal extrusion device is developed for on‐the‐spot generation of vascular grafts with tunable diameters spanning from 1 to 6 mm. The device uses biomimetic polymers and light, to promptly obtaining biocompatible and high‐burst pressure‐resistant grafts.
Deyanira Hernandez‐Sanchez   +11 more
wiley   +1 more source

Dielectric Barrier Discharge Electrothermal Heating and Additive Manufacturing of Thermoset Parts

open access: yesAdvanced Materials Technologies, EarlyView.
3D printing of thermosets is difficult due to the low yield stress of most uncured resins. However, by locally heating resin using a non‐equilibrium plasma, layers can be partially cured and printing enabled. Plasma application to a liquid epoxy/carbon nanotube composite is observed to cause rapid surface heating and oxidation of the cured layers ...
Ethan M. Harkin   +3 more
wiley   +1 more source

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