Results 211 to 220 of about 3,324,545 (359)

An Examination of Aerosol Jet‐Printed Surface Roughness and its Impact on the Performance of High‐Frequency Electronics

open access: yesAdvanced Engineering Materials, EarlyView.
This study explores aerosol jet‐printed (AJP) surface roughness, its effects on the performance of microwave electronics, and its process contributors. First, an electromagnetic model is vetted for AJP's unique roughness signature. Simulations are built which show process‐induced roughness is as significant as conductor resistivity in driving microwave
Christopher Areias, Alkim Akyurtlu
wiley   +1 more source

Fabrication of Compositionally Graded NiTi Shape Memory Alloy Laminated Composites Through Hot Roll Bonding and its Characterization

open access: yesAdvanced Engineering Materials, EarlyView.
A novel technique for fabricating monolithic functionally graded NiTi shape memory alloy (SMA) laminated hybrid composite has been developed. An excellent metallurgical bonding can be established between two compositionally different NiTi SMAs through spark plasma sintering joining/diffusion bonding followed by hot roll bonding.
Soumya Sinha   +2 more
wiley   +1 more source

Low‐Velocity Penetration Impact Behavior of Triply Periodic Minimal Surface Strut‐Based Lattices

open access: yesAdvanced Engineering Materials, EarlyView.
Triply periodic minimal surface (TPMS)‐based lattices are gaining attention for their multifunctional properties in applications as aeronautics and automotive, which involve low‐velocity impact loading. This work evaluates the low‐velocity penetration impact behavior of five distinct TPMS architectures.
Lucía Doyle   +2 more
wiley   +1 more source

Recent Progress on 2D‐Material‐Based Smart Textiles: Materials, Methods, and Multifunctionality

open access: yesAdvanced Engineering Materials, EarlyView.
Advancements in 2D‐material‐integrated smart textiles are reviewed, with a focus on materials, fabrication methods, and multifunctional applications, including energy harvesting, monitoring, EMI shielding, energy storage, and thermal management. The discussion addresses key challenges and provides insights into the future development of next‐generation
Yong Choi   +5 more
wiley   +1 more source

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