Results 51 to 60 of about 962,701 (301)
Advanced Engineering Materials, EarlyView.TiNi/Ti2AlN MAX phase films with different layer numbers are synthesized using a closed‐field unbalanced magnetron sputtering system. Their structural, mechanical, and tribological properties, as well as adhesion and fatigue performance, are analyzed as a function of the layer count to understand the effects of multilayer architecture on overall ...
Semih Duran +3 more
wiley +1 more source
Equivalent realisation circuit for a class of non-ideal voltage-controlled memristors
The Journal of Engineering, 2015 In this study, an equivalent realisation circuit with off-the-shelf components and devices is proposed, which can be used to equivalently implement a class of non-ideal voltage-controlled memristors.
Saihu Pan, Pan Jiang, Bocheng Bao
doaj +1 more source
Deformation Behavior of La2O3‐Doped Copper during Equal Channel Angular Pressing
Advanced Engineering Materials, EarlyView.By additions of strengthening elements and/or structure optimization, the mechanical properties of copper can be increased while keeping favorable electric conductivity. By combining addition of La2O3 and processing by equal channel angular pressing, substructure development is achieved, leading to increase in microhardness to more than double the ...
Lenka Kunčická +2 more
wiley +1 more source
On the Restricted Divisor Function in Arithmetic Progressions [PDF]
, 2010 We obtain several asymptotic estimates for the sums of the restricted divisor function $$ \tau_{M,N}(k) = #\{1 \le m \le M, \ 1\le n \le N: mn = k\} $$ over short arithmetic progressions, which improve some results of J. Truelsen.
Shparlinski, Igor E.
core
On additive and multiplicative arithmetical functions [PDF]
arXiv, 2011 A characterization of multiplicative (and additive) arithmetical functions is given. Using this characterization, we show that the group of multiplicative arithmetical functions is isomorphic to the group of additive arithmetical functions.
arxiv
Tunable Infrared Emissivity Using Laser‐Sintered Liquid Metal Nanoparticle Films
Advanced Functional Materials, EarlyView.This paper reports a decrease in the IR emissivity of liquid metal particle films after laser exposure. It is concluded that the decrease in IR emissivity is not due to changes in the film's topography but rather to sub‐surface sintering of the particles. This phenomenon enables encrypting messages and camouflaging laser‐processed patterns.
Sooik Im +12 more
wiley +1 more source
The Riemann-zeta function on vertical arithmetic progressions [PDF]
, 2012 We show that the twisted second moments of the Riemann zeta function averaged over the arithmetic progression $1/2 + i(an + b)$ with $a > 0$, $b$ real, exhibits a remarkable correspondance with the analogous continuous average and derive several ...
Li, Xiannan, Radziwill, Maksym
core +2 more sources
Arithmetical Functions : Infinite Products [PDF]
arXiv, 2012 In this technical report, certain interesting classification of arithmetical functions is proposed. The notion of additively decomposable and multiplicatively decomposable arithmetical functions is proposed. The concepts of arithmetical polynomials and arithmetical power series are introduced.
arxiv
Beyond scalar quasi-arithmetic means: Quasi-arithmetic averages and quasi-arithmetic mixtures in information geometry [PDF]
arXiv, 2023 We generalize quasi-arithmetic means beyond scalars by considering the gradient map of a Legendre type real-valued function. The gradient map of a Legendre type function is proven strictly comonotone with a global inverse. It thus yields a generalization of strictly mononotone and differentiable functions generating scalar quasi-arithmetic means ...
arxiv
Carbon Nanotube 3D Integrated Circuits: From Design to Applications
Advanced Functional Materials, EarlyView.As Moore's law approaches its physical limits, carbon nanotube (CNT) 3D integrated circuits (ICs) emerge as a promising alternative due to the miniaturization, high mobility, and low power consumption. CNT 3D ICs in optoelectronics, memory, and monolithic ICs are reviewed while addressing challenges in fabrication, design, and integration.
Han‐Yang Liu +3 more
wiley +1 more source