Results 141 to 150 of about 160,582 (294)

Microcellular Poly (Ethylene‐Co‐Vinyl Acetate)/Lignin Nanocomposites for Soft Ferroelectrets

open access: yesAdvanced Engineering Materials, EarlyView.
Lignin valorization for advanced porous polymer nanocomposites development and an upscaling route for continuous manufacturing of soft ferroelectrets for energy harvesting are studied. This work examines the role of lignin and carbon nanotubes (CNT) in modifying the mechanical, dielectric, and ferroelectret properties of poly (ethylene‐co‐vinyl acetate)
Yuchen Lian   +5 more
wiley   +1 more source

Surface Modification of Fluorine‐Free Superhydrophobic Materials with (Ultra‐)Thin TiO2 Layers

open access: yesAdvanced Engineering Materials, EarlyView.
Significant changes in wettability, with a reduction of 60o in the water conduct angle, are reported via the surface modification of fluorine‐free superhydrophobic thin films, prepared by aerosol‐assisted chemical vapor deposition, after coating a 4 nm layer of titanium dioxide on the surface using atomic layer deposition.
Julie Jalila Kalmoni   +2 more
wiley   +1 more source

Ultrasonic Atomization Spray Coating of PCL on an Mg‐Based Alloy Enhanced by Plasma Electrolytic Oxidation for Improved Adhesion, Corrosion Resistance, and Biocompatibility

open access: yesAdvanced Engineering Materials, EarlyView.
Plasma electrolytic oxidation is combined with ultrasonic spray deposition of polycaprolactone (PCL) on WE43 magnesium alloy to improve adhesion, corrosion resistance, and cytocompatibility. The hybrid coating demonstrates significantly reduced hydrogen evolution and enhances mechanical bonding, offering a promising strategy for next‐generation ...
Seyed Masih Mousavizadeh   +9 more
wiley   +1 more source

Multimodal Characterization of Sn‐Bi Solder Alloy Solidification Using Synchrotron X‐Ray Microtomography and Energy Dispersive Diffraction

open access: yesAdvanced Engineering Materials, EarlyView.
Real‐time imaging and energy‐dispersive diffraction during solidification of Sn‐Bi alloy interconnect for electronic packaging applications are studied. Sn‐Bi solder alloys have generated significant interest in recent times due to their potential use in electronic packaging.
Amey Luktuke   +3 more
wiley   +1 more source

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