Results 141 to 150 of about 160,582 (294)
Microcellular Poly (Ethylene‐Co‐Vinyl Acetate)/Lignin Nanocomposites for Soft Ferroelectrets
Lignin valorization for advanced porous polymer nanocomposites development and an upscaling route for continuous manufacturing of soft ferroelectrets for energy harvesting are studied. This work examines the role of lignin and carbon nanotubes (CNT) in modifying the mechanical, dielectric, and ferroelectret properties of poly (ethylene‐co‐vinyl acetate)
Yuchen Lian+5 more
wiley +1 more source
Introduction to atomic and nuclear physics by Henry Semat and John Albright [PDF]
J. H. Hamilton
openalex +1 more source
Surface Modification of Fluorine‐Free Superhydrophobic Materials with (Ultra‐)Thin TiO2 Layers
Significant changes in wettability, with a reduction of 60o in the water conduct angle, are reported via the surface modification of fluorine‐free superhydrophobic thin films, prepared by aerosol‐assisted chemical vapor deposition, after coating a 4 nm layer of titanium dioxide on the surface using atomic layer deposition.
Julie Jalila Kalmoni+2 more
wiley +1 more source
Forbes: The unpublished writings of Tobias Mayer/Großmann: Einführungskurs für die Physik/Beier, Wunderlich: Aufgabensammlung zur Biophysik/Wilke: Kristallzüchtung/Chrétien: Atomic Physics and Astrophysics, Vol. 2/Schulz: Particle Diffusion in the Radiation Belts [PDF]
J. O. Fleckenstein+5 more
openalex +1 more source
Plasma electrolytic oxidation is combined with ultrasonic spray deposition of polycaprolactone (PCL) on WE43 magnesium alloy to improve adhesion, corrosion resistance, and cytocompatibility. The hybrid coating demonstrates significantly reduced hydrogen evolution and enhances mechanical bonding, offering a promising strategy for next‐generation ...
Seyed Masih Mousavizadeh+9 more
wiley +1 more source
[Atomic physics]. Technical progress report for the period January 1 to September 15, 1967
openalex +2 more sources
Real‐time imaging and energy‐dispersive diffraction during solidification of Sn‐Bi alloy interconnect for electronic packaging applications are studied. Sn‐Bi solder alloys have generated significant interest in recent times due to their potential use in electronic packaging.
Amey Luktuke+3 more
wiley +1 more source
Production of a spin-polarized, metastable He(23 S) beam for studies in atomic and surface physics [PDF]
G. Baum, Wilhelm Raith, H. Steidl
openalex +1 more source