Results 251 to 260 of about 19,388,770 (317)

The impact of embodied cognition on place attachment and supportive behavior toward historic buildings in heritage sites: exploring the moderating role of resident identity climate. [PDF]

Front Psychol
Cai S, Hu Y, He J, Li K.
europepmc   +1 more source

Implicit processes in adult attachment

, 2008
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Romantic love conceptualized as an attachment process.

Journal of Personality and Social Psychology, 1987
This article explores the possibility that romantic love is an attachment process--a biosocial process by which affectional bonds are formed between adult lovers, just as affectional bonds are formed earlier in life between human infants and their parents.
C, Hazan, P, Shaver
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FINE STRUCTURE OF THE BACTERIOPHAGE ATTACHMENT PROCESS

Journal of Bacteriology, 1963
Cota-Robles , E. H. (University of California, Riverside) and M. D. Coffman . Fine structure of the bacteriophage attachment process. J. Bacteriol. 86: 266–273. 1963.—Electron microscopic examination of cells of Escherichia coli infected with coliphage T
E H, COTA-ROBLES, M D, COFFMAN
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The attachment process

Early Socialisation, 2020
C. Flanagan
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Some Investigations on Direct Substrate-Attachment Process for Wideband Instantaneous Frequency Measurement Receiver Development

IEEE Transactions on Components, Packaging, and Manufacturing Technology, 2020
Some critical investigations on direct substrate-attachment process over double-sided metallic housing have been discussed in this article under wideband instantaneous frequency measurement receiver development in detail. Conventional reflow method-based
Mahadev Sarkar, Vipin Kumar, R. Sivakumar, Satish Jhariya, R. RaghuB, S. SudheeshK   +5 more
semanticscholar   +1 more source

Attachment, Group–Related Processes, and Psychotherapy

International Journal of Group Psychotherapy, 2007
(2007). Attachment, Group–Related Processes, and Psychotherapy. International Journal of Group Psychotherapy: Vol. 57, No. 2, pp. 233-245.
Mario, Mikulincer, Phillip R, Shaver
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Robust superconducting die attach process

IEEE Transactions on Appiled Superconductivity, 1997
As complexity of superconducting digital systems increase, the need for multi-chip modules and a reliable, high bandwidth attachment scheme for superconducting die becomes more and more critical. We have developed a flip chip die attach process for Low Temperature Superconducting (LTS) chips using InSn reflow soldering. Using standard reflow techniques,
K.E. Yokoyama, G. Akerling, A.D. Smith, M. Wire   +3 more
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