Results 141 to 150 of about 351,630 (281)

Automotive Cybersecurity Engineering with Modeling Support [PDF]

open access: yesAnnals of computer science and information systems
Alexander Fischer   +2 more
doaj   +1 more source

Designing Advanced Soft Magnetic Powder Cores with Ultralow Energy Loss by Combining Ultrasonic and Static Compaction

open access: yesAdvanced Science, EarlyView.
Increasing the density and homogeneity of soft magnetic composites are critical for achieving high power density and low core loss. This work proposes a novel strategy by combining ultrasonic‐assisted pressing and cold pressing. In this line, the density and permeability of magnetic core have been increased a lot, while the core loss is decreased ...
Xiaoying Huang   +15 more
wiley   +1 more source

Review: Insight on Porous Carbon Positive Electrode for Sodium‐Ion Capacitors: Interplay Between Synthesis, Properties, and Performance

open access: yesAdvanced Science, EarlyView.
Sodium ion capacitor (SIC) is currently constrained by the low discharge capacity of commercial activated carbon as positive electrode material. This review provides a holistic summary of research efforts on alternative porous carbon materials for SIC. Image created by the authors with www.biorender.com.
Ademola Adeniji   +2 more
wiley   +1 more source

Upgrading of Symbolic and Synthetic Knowledge Bases: Analysis of the Architecture, Engineering and Construction industry and the Automotive Industry in China [PDF]

open access: yes
The degree and the way of upgrading differ widely per industry. This article tries to give some new insights in these differences by linking the concept of upgrading to that of the knowledge base.
Erwin van Tuijl, Jan van der Borg
core  

Emerging Advanced Electronic Packaging Materials for Thermal Management in Power Electronics

open access: yesAdvanced Science, EarlyView.
This review surveys emerging materials for thermal management in advanced electronic packaging, with emphasis on ceramic substrates and thermal interface materials. Multiscale simulations and mechanistic analyses are highlighted, alongside the emerging role of artificial intelligence in predicting thermal properties and guiding design, offering ...
Yongjun Huo   +11 more
wiley   +1 more source

Novel Phosphazenium Tetrafluoroborate Dopant Enables Efficient and Thermally Stable n‐Doped Organic Semiconductors

open access: yesAdvanced Electronic Materials, EarlyView.
A novel n‐dopant, phosphazenium tetrafluoroborate (P2BF4), is introduced for efficient n‐doping in N2200, P(PzDPP‐CT2) and other organic semiconductors (OSCs). P2BF4‐doped OSC films exhibit exceptional thermal stability, maintaining electrical conductivity after heating at > 150 °C for 24 h. This stability allows organic thermoelectric devices based on
Huan Wei   +11 more
wiley   +1 more source

Recycled Piezoelectric Materials with Competitive Second‐Life Functional Properties

open access: yesAdvanced Electronic Materials, EarlyView.
The essential piezoelectric ceramics with heavy ecological footprints are not sufficiently recycled. This work demonstrates the feasibility of recycling different types of piezoelectric ceramics using different binders, where the terpolymer binder with relatively large permittivity facilitated superior retention of properties after recycling, promoting
Mohadeseh Tabeshfar   +2 more
wiley   +1 more source

Performance Enhancement in Hafnium Oxide Through Homogeneous and Heterogeneous co‐Doping Strategies

open access: yesAdvanced Electronic Materials, EarlyView.
This article presents a comprehensive co‐doping toolkit to optimize the performance and reliability of fluorite‐structure ferroelectrics like hafnium oxide. By employing homogeneous and heterogeneous co‐doping strategies, precise control over crystallization behavior, polarization hysteresis, and oxygen vacancy distribution is achieved.
Shouzhuo Yang   +10 more
wiley   +1 more source

Emerging Memory and Device Technologies for Hardware‐Accelerated Model Training and Inference

open access: yesAdvanced Electronic Materials, EarlyView.
This review investigates the suitability of various emerging memory technologies as compute‐in‐memory hardware for artificial intelligence (AI) applications. Distinct requirements for training‐ and inference‐centric computing are discussed, spanning device physics, materials, and system integration.
Yoonho Cho   +6 more
wiley   +1 more source

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