Results 211 to 220 of about 3,517,113 (302)

Soft Yet Tough Tanglemers Through Rapid Photopolymerization for DLP 3D Printing

open access: yesAdvanced Materials, EarlyView.
Soft yet tough tanglemers are produced through low‐initiator free radical photopolymerization and translated to DLP 3D printing. Systematic control over light intensity, initiator loading, and crosslink density reveals processing windows that balance printability, elasticity, toughness, and feature fidelity. ABSTRACT Additive manufacturing of compliant
Yutong Liu   +5 more
wiley   +1 more source

Understanding Operando Water Management in Hydroxide‐Exchange‐Membrane Fuel Cells

open access: yesAdvanced Materials Interfaces, EarlyView.
Effective water management is vital for high‐performance hydroxide‐exchange‐membrane fuel cells. Using a custom water‐flux station, this study quantifies how membrane thickness, microporous layers, and operating conditions dictate internal water transport.
Catherine M. Weiss   +4 more
wiley   +1 more source

Smart Antibacterial Coatings: Harnessing Bacterial Redox Activity for Infection Control

open access: yesAdvanced Materials Interfaces, EarlyView.
In this study, we have shown that ceftazidime‐loaded poly(3,4‐ethylenedioxythiophene) (PEDOT@CAZ) functions as a smart, redox‐responsive antibacterial coating that couples bacterial electrical activity with localized antibiotic delivery. Shewanella oneidensis and Pseudomonas aeruginosa induced distinct redox responses in PEDOT, reflecting their ...
Abdullah   +8 more
wiley   +1 more source

Controlled Synthesis of Tri‐ and Multi‐Doped Graphene

open access: yesAdvanced Materials Interfaces, EarlyView.
This review systematically evaluates synthesis routes for tri‐ and multi‐doped graphene, from hydrothermal and pyrolysis methods to flash Joule heating, critically assessing how each governs dopant incorporation, bonding configuration, and resulting electronic properties.
Maria Hasan   +4 more
wiley   +1 more source

Recent Advances in Plasma‐Enhanced Atomic Layer Etching for Next‐Generation Nanofabrication

open access: yesAdvanced Materials Interfaces, EarlyView.
Continued semiconductor miniaturization demands atomic‐scale patterning and ultralow surface roughness beyond the capabilities of conventional reactive ion etching. This review highlights advances in isotropic and anisotropic plasma‐enhanced atomic layer etching since 2020, covering fundamental mechanisms, applications across major semiconductor ...
Shih‐Nan Hsiao
wiley   +1 more source

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