Results 221 to 230 of about 740,246 (236)
Some of the next articles are maybe not open access.
Solder joint attachment reliability and assembly quality of a molded ball grid array socket
2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220), 2002This paper summarizes efforts to improve the assembly quality and solder joint reliability of a molded, plastic ball grid array socket. Metallographic analysis shows that a ball grid array type solder interconnect has superior assembly quality compared to a butt type solder interconnect.
R.J. Coyle +10 more
openaire +1 more source
Journal of Mechanical Science and Technology, 2014
Microelectromechanical system (MEMS) test sockets with attached tips were developed for a ball-grid-array integrated circuit (BGA IC) package, using MEMS fabrication technology in conjunction with Ni-Co electroplating and XeF2 isotropic silicon etching.
Kim, Sangwon +6 more
openaire +2 more sources
Microelectromechanical system (MEMS) test sockets with attached tips were developed for a ball-grid-array integrated circuit (BGA IC) package, using MEMS fabrication technology in conjunction with Ni-Co electroplating and XeF2 isotropic silicon etching.
Kim, Sangwon +6 more
openaire +2 more sources
Overdenture retention and stabilization with ball-and-socket attachments: principles and technique.
Journal of dental technology : the peer-reviewed publication of the National Association of Dental Laboratories, 1998Implant attachments of various designs are used to retain, stabilize and sometimes support overdentures. Tissue supported overdentures stabilized and retained by two to four implants are often the restorations of choice due to patient preference, limitations in finances, insufficient available bone to accommodate a greater number of implants, or needed
B, Banton, M D, Henry
openaire +1 more source
Medial Ball and Socket Total Knee Arthroplasty: Five-Year Clinical Results
Bone and Joint Journal, 2019W L Walter
exaly
Parametrization and Range of Motion of the Ball-and-Socket Joint
IFIP Advances in Information and Communication Technology, 2001Ronan Boulic
exaly
A solderless technique for ball-and-socket attachments.
Quintessence of dental technology, 1982openaire +1 more source
Solder Joint Attachment Reliability and Assembly Quality of a Molded Ball Grid Array Socket
2001R J Coyle, P P Solan
exaly

