Results 81 to 90 of about 560,047 (295)

Lattice Structures for Bone Replacement: The Intersection of Bone Biomechanics, Lattice Design, and Additive Manufacturing

open access: yesAdvanced Materials Technologies, EarlyView.
This review outlines how understanding bone's biology, hierarchical architecture, and mechanical anisotropy informs the design of lattice structures that replicate bone morphology and mechanical behavior. Additive manufacturing enables the fabrication of orthopedic implants that incorporate such structures using a range of engineering materials ...
Stylianos Kechagias   +4 more
wiley   +1 more source

STUDY ON ELECTRONIC PACKAGE MINIATURE BALL GRID ARRAY SOLDER JOINTS STRESS AND STRAIN UNDER THREE POINT BENDING

open access: yesJixie qiangdu, 2016
The miniature ball grid array( BGA) solder joint three point bending stress and strain finite element analysis models were set up,and the influences of ball diameter,ball height,pad diameter and bending load speed on the stress and strain of miniature ...
LIANG Ying   +5 more
doaj  

Anti‐Slip Material‐Based Strategies and Approaches

open access: yesAdvanced Materials Technologies, EarlyView.
This review highlights the principle mechanisms of slipping at the microscale, linking contact mechanics with a friction behavior model for surface interfaces. Main strategies to develop anti‐slip properties to the surfaces are discussed alongside standardized testing approaches.
Sogand Abbaspoor‐Zanjani   +3 more
wiley   +1 more source

Advances in Solid‐Phase Processing Techniques: Innovations, Applications, and Future Perspectives

open access: yesAdvanced Materials Technologies, EarlyView.
Based on practical manufacturing challenges, this review examines advanced solid‐phase processing techniques that overcome the inherent limitations of conventional melting‐based and traditional solid‐phase manufacturing, enabling the production of higher‐performance components at reduced cost through process innovation and improved supply‐chain ...
Tianhao Wang
wiley   +1 more source

Kinematic analysis of punt kick in football goalkeepers based on the level of kick effort [PDF]

open access: yes, 2015
In the present study, we aimed to investigate the differences in punt kicks by football goalkeepers based on the level of effort required. Twelve experienced goalkeepers participated in the study.
Funato Kazuo   +5 more
core  

Transducers Across Scales and Frequencies: A System‐Level Framework for Multiphysics Integration and Co‐Design

open access: yesAdvanced Materials Technologies, EarlyView.
Transducers convert physical signals into electrical and optical representations, yet each mechanism is bounded by intrinsic trade‐offs across bandwidth, sensitivity, speed, and energy. This review maps transduction mechanisms across physical scale and frequency, showing how heterogeneous integration and multiphysics co‐design transform isolated ...
Aolei Xu   +8 more
wiley   +1 more source

Fabric‐Based Wearable Robotic Exoskeleton Gloves: Advancements and Challenges

open access: yesAdvanced Materials Technologies, EarlyView.
This review highlights interdisciplinary technological advances in fabric‐based robotic gloves, focusing on progress in design, fabrication, actuation, sensing, control, and power and energy requirements. It also addresses performance testing and validation, including biomechanical, strength, functional, user experience, and durability assessments, to ...
Ayse Feyza Yilmaz   +2 more
wiley   +1 more source

Fatigue Life Evaluation of Solder Ball Joints.

open access: yesThe Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits, 1997
半導体BGAパッケージのはんだボール接合部は接続強度, 信頼性上重要な箇所である。はんだ接合部を有する試験片を作成し, せん断試験を行って疲労寿命を評価した。疲労試験後の接合部の走査型電子顕微鏡観察から, き裂発生箇所は疲労振幅の大小により異なることがわかった。一方, 有限要素法による3次元弾塑性解析を行い接合部のひずみ分布を求めた。解析結果から最大のひずみが生ずる箇所は疲労試験で得られたき裂が生じる箇所と一致することがわかった。この最大ひずみが発生する箇所を考慮してひずみと寿命との関係を求めた。
Tetsuo KUMAZAWA   +4 more
openaire   +2 more sources

In Situ Copper Electroplating Turns Material Extrusion 3D Printers Into Metal–Polymer Hybrid Fabricators

open access: yesAdvanced Materials Technologies, EarlyView.
An in situ electroplating approach for MEX 3D printing is proposed, enabling copper deposition during the fabrication of conductive polymers. The method combines a printer‐integrated plating head, ML‐based g‐code control, and stop‐and‐go printing, achieving near‐bulk copper conductivity and enabling fully embedded, assembly‐free electronic components ...
Gianluca Percoco   +5 more
wiley   +1 more source

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