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Electroless Plating of Copper on Laser‐Induced Graphene for Flexible Hybrid Electronic Applications

open access: yesAdvanced Materials Technologies, EarlyView.
Copper‐plated Laser‐Induced Graphene (Cu‐LIG) provides a facile and economical approach to patterning FHEs. This patterning process is enabled by incorporating catalytically active palladium nanoparticles into the LIG structure, which serve as surface reaction sites for reducing copper ions in solution plating.
Attila Rektor   +7 more
wiley   +1 more source

Strain Amplification via Helically Braided Fiber Reinforced Sleeve for Soft Material Energy Harvesting

open access: yesAdvanced Materials Technologies, EarlyView.
This study presents a braided fiber‐reinforced sleeve that amplifies strain in soft materials, enhancing their performance in stretchable devices like sensors and energy harvesters. By reinforcing and elongating encased materials, the sleeve increases the “effective” strain.
Emily Duan   +4 more
wiley   +1 more source

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