Results 101 to 110 of about 6,279,870 (170)

Digital twins for lifespan prediction of used storage racks. [PDF]

Sci Rep
Bi Z, Mueller D, Chen B, Luo C, Li M.
europepmc   +1 more source

Volatile and non-volatile nano-electromechanical switches fabricated in a CMOS-compatible silicon-on-insulator foundry process. [PDF]

Microsyst Nanoeng
Li Y, Bleiker SJ, Worsey E, Dagon M, Edinger P, Takabayashi AY, Quack N, Verheyen P, Bogaerts W, Gylfason KB, Pamunuwa D, Niklaus F.   +11 more
europepmc   +1 more source

Imaging topological polar structures in marginally twisted 2D semiconductors. [PDF]

Sci Adv
Vu TH, Bennett D, Pallewela GN, Maniatis J, Edwards J, Uddin MH, Xing K, Resendiz-Vazquez P, Lee SH, Mao Z, Muir JB, Jia L, Davis JA, Watanabe K, Taniguchi T, Adam S, Sharma P, Fuhrer MS, Edmonds MT.   +18 more
europepmc   +1 more source

Theoretical Analysis and Characteristic Study of Li-Doped P-Type ZnO Ultra-Thin Cantilever Beam Accelerometer. [PDF]

Materials (Basel)
Shang Y, Bi J, Liu W, Ai C, Zhang H.
europepmc   +1 more source

Adding ¹⁶¹Dy-Mössbauer spectroscopy to a multitechnique investigation of magnetic transitions in a {Co^III₃Dy^III₃} Single-Molecule Toroic. [PDF]

Nat Commun
Peng Y, Braun J, Scherthan L, Auerbach H, Wolny JA, Schulze M, Alp EE, Zhao J, Bi W, Tesi L, Anson CE, Moilanen JO, Brown DE, Chibotaru LF, Wernsdorfer W, Perfetti M, Sessoli R, Schünemann V, Powell AK.   +18 more
europepmc   +1 more source

Analysis of Post-Bonding Crack-Induced Double Cantilever Bending (PDC-DCB) Method for Hybrid Bonding Strength Measurement. [PDF]

Materials (Basel)
Mei C, Zheng T, Hu Q, Chen Y, Xu Y, Zhao H, Chang L, Yuan Y, Yu Z, Li L.   +9 more
europepmc   +1 more source

Scale-Specific Viscoelastic Characterization of Hydrogels: Integrated AFM and Finite Element Modeling. [PDF]

Small
Fertala N, Uhlmann K, Grigoryev E, Seth P, Friedrichs J, Thiele J, Werner C, Balzani D.   +7 more
europepmc   +1 more source

Experimentally characterising the dynamical landscape of an active MEMS cantilever. [PDF]

Commun Eng
Hayashi S, Cameron C, Gutschmidt S, Murray R, Krauskopf B.   +4 more
europepmc   +1 more source

A Comprehensive Experimental and Finite Element Analysis Study on the Bonding Strength Evaluation of Wafer-to-Wafer Hybrid Bonding with Polyimide Film Dielectrics. [PDF]

Micromachines (Basel)
Mei C, Zheng T, Ding Z, Zhang D, Xu Y, Zhao H, Chang L, Hu Q, Xia C, Liu S, Li L.   +10 more
europepmc   +1 more source

Microjoining for biomedical device fabrication: a perspective. [PDF]

Adv Mater Join
Zhang K, Zhou YN, Peng P.
europepmc   +1 more source