Results 111 to 120 of about 97,350 (281)
Electrical Conductivities of Conductors, Semiconductors, and Their Mixtures at Elevated Temperatures
This article presents a comprehensive review of temperature‐dependent electrical conductivity data for multiple material classes at elevated temperatures, highlighting a persistent conductivity gap between metals and semiconductors in the range of 102$\left(10\right)^{2}$– 107$\left(10\right)^{7}$ S/m. Metal–ceramic irregular metamaterials are proposed
Valentina Torres Nieto, Marcia A. Cooper
wiley +1 more source
Fungal mycelia grown into biodegradable scaffolds and infused with titania nanoparticles show enhanced ultraviolet shielding, thermal protection, and surface nonwettability. Properties were tuned by drying methods, revealing structure–function relationships.
Juwon S. Afolayan +2 more
wiley +1 more source
A combined finite element and phase‐field approach predicts the evolution of microstructure during the directional solidification of Ni‐based superalloys. The model reveals how withdrawal rate, temperature gradient, and wall thickness control the dendrite spacing, highlighting the strong effect of surface regions in thin sections where dendrite growth ...
Sean Böhm +3 more
wiley +1 more source
This study investigates laser‐based oxide removal of Cu inserts in oxygen‐free conditions and examines long‐term oxidation kinetics and surface chemistry under different atmospheres via X‐ray photoelectron spectroscopy. Al–Cu compound casting with differently oxidized surfaces is performed, and intermetallic phase formation, morphology, and thermal ...
Timon Steinhoff +9 more
wiley +1 more source
Prover - Toward More Efficient Formal Verification of Masking in Probing Model
In recent years, formal verification has emerged as a crucial method for assessing security against Side-Channel attacks of masked implementations, owing to its remarkable versatility and high degree of automation.
Feng Zhou, Hua Chen, Limin Fan
doaj +1 more source
The wettability of aluminum droplets (Al) on different copper substrates (Cu), where liquid Al spreads on solid Cu surfaces to form a liquid–solid interface, is studied numerically and experimentally. The experimental and numerical results show good agreement in the fast‐spreading regime.
Shan Lyu +8 more
wiley +1 more source
SPPsolver: a SAT-based algorithm for solving any stable paths problem correctly
The Stable Paths Problem (SPP) is a widely adopted model for analyzing the convergence of Border Gateway Protocol (BGP). Solving SPP correctly is of great significance for determining BGP convergence.
Wenwu Yan +5 more
doaj +1 more source
Low‐Angle Grain Boundaries and Re‐Segregation in Single‐Crystalline Ni‐Base Superalloys
This work demonstrates that Re‐segregation at low‐angle grain boundaries (LAGBs) in Ni‐base superalloys is influenced by misorientation angle. Advanced microscopy and atom probe tomography reveal that higher misorientation angles increases Re‐segregation.
Alireza B. Parsa +9 more
wiley +1 more source
Surface Tension Measurement of Ti‐6Al‐4V by Falling Droplet Method in Oxygen‐Free Atmosphere
In this article, the temperature‐dependent surface tension of free falling, oscillating Ti‐6Al‐4V droplets is investigated in both argon and monosilane doped, oxygen‐free atmosphere. Droplet temperature and oscillation are captured with one single high‐speed camera, and the surface tension is calculated with Rayleigh's formula.
Johannes May +9 more
wiley +1 more source
Phase‐field simulations coupled with dislocation‐density‐based crystal plasticity modeling reproduce γ′ rafting behavior in single‐crystal Ni‐based superalloys under varied loading conditions. The model captures both macroscopic creep and microscopic morphology evolution, with results matching high‐temperature creep experiments.
Micheal Younan +5 more
wiley +1 more source

