Advanced Optical Integration Processes for Photonic‐Integrated Circuit Packaging
Photonic integrated chip packaging is a growing technology that helps make devices faster, more efficient, and more compact by using light instead of electricity. This review highlights recent progress in making these chips work better at different levels, discusses current challenges like heat and alignment, and looks at future possibilities for ...
Keuntae Baek+4 more
wiley +1 more source
Incorporating buccal mass planar mechanics and anatomical features improves neuromechanical modeling of Aplysia feeding behavior. [PDF]
Bennington MJ+9 more
europepmc +1 more source
High Aspect Ratio, Superconducting Vacuum Gap Capacitor NEMS with Plate Distances Down to 32 nm
Fabrication of aluminium vacuum gap capacitor based NEMS is investigated with a free to move top electrode. To avoid collapse of the top electrode vertical stress gradient is controlled through sputter parameters. The result is wafer‐level high‐yield fabrication of vacuum gap capacitors with radii between 7 µm and 30 µm and integrated piezoactuators. A
Ioan Ignat, Daniel Platz, Ulrich Schmid
wiley +1 more source
Observations on the associations between damaging and aggressive behaviors, related lesions, and their implications for the welfare of pigs in the grower-finisher period. [PDF]
Markland L+4 more
europepmc +1 more source
This study examines a soft gripper with a NiTiCu6 Shape Memory Alloy (SMA) wire embedded in a graphene nanoparticle (GNP)‐functionalized PDMS matrix. Comparing GNP‐enhanced and plain elastomer prototypes, results show that GNPs improve cooling rates, accelerating release by 40%, but increase energy consumption in low‐current activations.
Fabio Lazzari+5 more
wiley +1 more source
Novel Insight into <i>Culicoides</i> (Diptera: Ceratopogonidae) Host Preferences and the First Evidence of Avian Haemosporidian Parasites in Biting Midges in Slovakia. [PDF]
Janošková N+4 more
europepmc +1 more source
This article presents a novel strategy for creating highly stretchable wireless circuits using electrical metamaterial‐based interconnects (EMIs). Embedded in soft polymers and filled with liquid metal, EMIs uniquely reduce resistance under strain. A fully integrated ECG circuit demonstrates reliable performance under 100% stretch, offering a highly ...
Anan Zhang+2 more
wiley +1 more source
Compositional Analysis of Longshan Period Pottery and Ceramic Raw Materials in the Yongcheng Region, Henan Province. [PDF]
Xia L, Li Y, Zhang G, Li J, Jaang L.
europepmc +1 more source