Results 261 to 270 of about 1,405,072 (310)
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Soldering, Adhesive Bonding, and Bonding
2015This chapter discusses and analyzes the bonding of OEIC and its electrical and thermal environment. First, the bonding interface between the OEIC and the heat sink would be investigated. In the following, failure mechanisms and reliability tests are discussed.
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Encoding and decoding hydrogen-bond patterns of organic compounds
, 1990M. C. Etter
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Electrochemical Oxidation Induced Selective C–C Bond Cleavage
Chemical Reviews, 2021Yujie Liang, Ning Jiao
exaly
On financial contracting: An analysis of bond covenants
, 1979Clifford W. Smith, Jerold B. Warner
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The structural basis of ribosome activity in peptide bond synthesis.
Science, 2000P. Nissen +4 more
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Transition-Metal-Catalyzed C–H Bond Activation for the Formation of C–C Bonds in Complex Molecules
Chemical Reviews, 2023Jamie Docherty, , Michael T Findlay
exaly
Aryl-aryl bond formation by transition-metal-catalyzed direct arylation.
Chemical Reviews, 2007Dino Alberico, Mark E. Scott, M. Lautens
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