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Soldering, Adhesive Bonding, and Bonding

2015
This chapter discusses and analyzes the bonding of OEIC and its electrical and thermal environment. First, the bonding interface between the OEIC and the heat sink would be investigated. In the following, failure mechanisms and reliability tests are discussed.
openaire   +2 more sources

Electrochemical Oxidation Induced Selective C–C Bond Cleavage

Chemical Reviews, 2021
Yujie Liang, Ning Jiao
exaly  

The structural basis of ribosome activity in peptide bond synthesis.

Science, 2000
P. Nissen   +4 more
semanticscholar   +1 more source

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