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Green Bonds, Landscape Bonds, and Rainforest Bonds

2017
Green bonds, particularly green bonds applied to the forestry sector, are a newly emerging conservation finance instrument. The author presents an historical overview, provides details on the mechanisms, presents 1 case study, and then undertakes both a financial analysis and a policy analysis, along with a future outlook.
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One-electron bonds are not “half-bonds”

Physical Chemistry Chemical Physics, 2019
The formation of one-electron bonds follows the same mechanism as the regular covalent bonds. It is the same phenomenon, quantum interference, that rules the stabilization of systems containing such bonds and there is no distinction between one- and two-electron bonds from the conceptual point of view.
David Wilian Oliveira de Sousa   +1 more
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Natural bond orbital analysis of near‐Hartree–Fock water dimer

, 1983
We have carried out a natural bond orbital analysis of hydrogen bonding in the water dimer for the near‐Hartree–Fock wave function of Popkie, Kistenmacher, and Clementi, extending previous studies based on smaller basis sets and less realistic geometry ...
A. E. Reed, F. Weinhold
semanticscholar   +1 more source

Another look at bonds and bonding

Structural Chemistry, 2019
Because electrostatic flux does not depend on the location of the charges it links, it is independent of the quantum mechanical charge distribution in a molecule. By identifying a chemical bond with the electrostatic flux linking an atom’s core to its valence charge, one can generate a purely classical model of chemical bonding. The resulting bond flux
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How Bonded Is A Bonded Crown?

Dental Update, 2000
In Vitro Leakage of Resin-bonded Allporcelain Crowns. M. Ferrari, F. Mannocci, P. N. Mason, G. Kugel. Journal of Adhesive Dentistry 1999; 1: 233-242.
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Automatic atom type and bond type perception in molecular mechanical calculations.

Journal of Molecular Graphics and Modelling, 2006
Junmei Wang   +3 more
semanticscholar   +1 more source

Soldering, Adhesive Bonding, and Bonding

2015
This chapter discusses and analyzes the bonding of OEIC and its electrical and thermal environment. First, the bonding interface between the OEIC and the heat sink would be investigated. In the following, failure mechanisms and reliability tests are discussed.
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