Results 21 to 30 of about 756,349 (257)
Orthodontic bonding – a national survey: Part I – Eesolts and Inferences
A survey of orthodontists in Australia was conducted in 1984. Of 325 questionnaires, there were 203 (65%) respondents. Over 90% had been bonding for three or more years, with a clear preference for composites over acrylic, for smaller mesh bases over ...
Russell Mark L. +2 more
doaj +1 more source
In this tribute to John B. Goodenough I will describe how John’s talk on the metal-to-nonmetal transition of vanadium oxide VO2, presented at the Bordeaux Conference (September 1964) attended by inorganic chemists, metallurgists, crystallographers ...
Michel Pouchard
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Direct bonding with on-wafer metal interconnections
S.391-396A low temperature direct bonding process with encapsulated metal interconnections was proposed. The process can be realized between silicon wafers or silicon and glass wafers.
Jia, C., Wiemer, M., Gessner, T.
core +1 more source
The bonding of glass substrates is necessary when constructing micro/nanofluidic devices for sealing micro- and nanochannels. Recently, a low-temperature glass bonding method utilizing surface activation with plasma was developed to realize micro ...
Koki Shoda +3 more
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Effect of the nanofilm-coated zirconia ceramic on resin cement bond strength [PDF]
Background. New surface treatments have been proposed to expand the clinical indications of zirconia prostheses. This study aimed to evaluate the effect of silica and fluorine nanofilms on zirconia ceramic on the resin cement bond strength.
Viviane Maria Gonçalves de Figueiredo +7 more
doaj +1 more source
Using Hemostatic Agents During Orthodontic Bonding: An In Vitro Study
Objective:The aim of this in vitro study was to compare the effect of a traditional hemostatic agent on the shear bond strength (SBS) of conventional and self-etching bonding systems to find an efficient procedure for orthodontic bonding.Material and ...
Berat Serdar Akdeniz +4 more
doaj +1 more source
Fabrication of wafer-level thermocompression bonding
Thermocompression bonding of gold is a promising technique for achieving low temperature, wafer-level bonding. The fabrication process for wafer bonding at 300ºC via compressing gold under 7 MPa of pressure is described in detail.
Tsau, C.H. +2 more
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Knowledge of Mothers on Multisensory Intervention for Preterm Babies: A Hospital-based Cross-sectional Study from Mangaluru, India [PDF]
Introduction: Multisensory intervention for preterm babies is developmentally appropriate and has the capacity to integrate information from different senses-Auditory, Tactile, Visual, and Vestibular (ATVV). Involving mothers in the intervention may help
Sonya Sequeira +2 more
doaj +1 more source
Low temperature metal interdiffusion bonding for micro devices
S.163We demonstrate solid liquid interdiffusion bonding by gallium and gold as bonding material and show the bonding at 40°C. Because of the low melting point of gallium of 29.8°C several difficulties for processing the gallium exists.
Wiemer, Maik +4 more
core +1 more source
Development of nonuniform residual stresses during anodic bonding
S.553-562Nonuniform residual stresses may develop during anodic bonding due to variations in wafer curvature prior to bonding or due to nanotopography interactions between the bonding surfaces.
Gerbach, R. +5 more
core +2 more sources

