Results 91 to 100 of about 189,008 (316)

Effect of Laser Deoxidation on Adhesive‐Bonded Aluminum in an Oxygen‐Free Atmosphere

Advanced Engineering Materials, EarlyView.
This study investigates laser ablation of aluminum under oxygen‐free conditions. The goal is to produce oxide‐free substrates that enable improved adhesive bonding with epoxy. Optimized laser parameters (90% overlap, 300 µJ) combined with oxide‐free substrates result in the highest tensile strength of the adhesive bond.
Sandra Gerland, Finn‐Lennard Janthur, Sarah Seffer, Jörg Hermsdorf, Ludger Overmeyer, Annika Raatz   +5 more
wiley   +1 more source

Ultrasonic Wire Bonding Technology in High-power IGBT Module Assembly

Kongzhi Yu Xinxi Jishu, 2011
It introduces the mechanism of ultrasonic wire bonding, analyzes the material properties and the interface characteristics of the bonding for high-power IGBT module, and discusses the effects of bonding parameters on bonding strength.
覃荣震, 张泉
doaj  

Development and application of micromechanical techniques for characterising interfacial shear strength in fibre-thermoplastic composites

, 2012
The development of single fibre pull-out and microbond tests for characterising interfacial strength in thermoplastic composites is reviewed in detail. Manufacture of an experimental jig and sample preparation regimes for both tests are described.
Thomason, James, Yang, Liu
core   +1 more source

Tensile bond strength of maxillofacial adhesives

The Journal of Prosthetic Dentistry, 1993
A common technique for fixation of facial prostheses is the use of skin adhesives. The present study compared the tensile bond strength of five RTV-silicone elastomers used with four different skin adhesives to human skin. The elastomers were: Silskin II, MDX4-4210, Cosmesil, Cosmesil HC2, and RS 330 T-RTV.
POLYZOIS, GL, OILO, G, DAHL, JE
openaire   +3 more sources

Powder Optimization Strategies for Binder Jetting Printing of BaTiO3 and Ba0,6Sr0,4TiO3 Ceramics

Advanced Engineering Materials, EarlyView.
Powder optimization is investigated to enable binder jetting of BaTiO3 and Ba0.6Sr0.4TiO3 ferroelectric ceramics. The antagonistic relationship between flowability and binder compatibility is addressed through binder impregnation of granulated powders and fumed silica addition to fine powders.
Fanny Pruvost, Lionel Presmanes, Soléna Colin, Marie Vidal, Sophie Guillemet‐Fritsch   +4 more
wiley   +1 more source

Formation of a nano-porous structured Cu layer by selective etching of a brass layer and sinter-bonding to achieve direct Cu–Cu bonding

Journal of Materials Research and Technology
A nano porous structured (NPS) Cu layer was fabricated by a Zn plating-annealing-selective etching process. Furthermore, sinter-bonding was performed by thermocompression after forming the NPS Cu layer instead of the conventional paste sinter-bonding ...
Wan-Geun Lee, Kwang-Seong Choi, Yong-Sung Eom, Jong-Hyun Lee   +3 more
doaj   +1 more source

Influência da limpeza pós-condicionamento e do método de secagem do silano sobre a união resina-cerâmica [PDF]

, 2012
Dissertação (mestrado) - Universidade Federal de Santa Catarina, Centro de Ciências da Saúde. Programa de Pós-Graduação em OdontologiaObjetivos: avaliar a influência da limpeza pós-condicionamento e do método de secagem do silano sobre a resistência de ...
Siedschlag, Gustavo
core  

Influence of an Oxygen‐Free Atmosphere on Diamond‐Single‐Grain Scratching of Ti–6Al–4V

Advanced Engineering Materials, EarlyView.
Single‐grain scratching of Ti–6Al–4V is investigated under controlled, oxygen‐free, and ambient atmospheres using a novel experimental setup with in situ high‐speed imaging. The approach enables direct observation of chip formation and adhesion under suppressed oxidation.
Berend Denkena, Benjamin Bergmann, Michael Zenger   +2 more
wiley   +1 more source

Al–Cu Composite Casting of Laser‐Deoxidized Copper: Bonding, Interfacial Chemistry, and Thermal Conductivity

Advanced Engineering Materials, EarlyView.
This study investigates laser‐based oxide removal of Cu inserts in oxygen‐free conditions and examines long‐term oxidation kinetics and surface chemistry under different atmospheres via X‐ray photoelectron spectroscopy. Al–Cu compound casting with differently oxidized surfaces is performed, and intermetallic phase formation, morphology, and thermal ...
Timon Steinhoff, Finn‐Lennard Janthur, Sascha Zimmermann, Sarah Seffer, Jörg Hermsdorf, René Gustus, Ludger Overmeyer, Wolfgang Maus‐Friedrichs, Hans Jürgen Maier, Christian Klose   +9 more
wiley   +1 more source

Low temperature bonding of hetero-materials using ambient pressure plasma activation

, 2022
S.73-74One critical parameter in wafer level bonding is the process temperature. It should be kept as low as possible. Therefore the reasons are low-melting materials used for vias and different coefficients of thermal expansion (CTE) of bonding partners.
Wünsch, D., Bräuer, J., Wiemer, M., Gessner, T., Hennecke, P., Eichler, M.   +5 more
core