Results 211 to 220 of about 527,814 (258)
Comparison of bond and transverse strength of five soft denture liners to polymethyl methacrylate
, 1996 Nur HERSEK +2 more
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Bond Strengths: The Importance of Hyperconjugation
Organic Letters, 2006[Structure: see text] Gronert (J. Org. Chem. 2006, 71, 1209) has challenged the importance of hyperconjugation in determining C-H bond dissociation enthalpies (BDEs) in alkanes. Electron paramaganetic resonance spectra of H3CCH2*, (H3C)2CH*, and (H3C)3C* show significant positive spin on their beta-H3C groups' hydrogens. A 55%/45% partitioning of these
Ingold, K. U., DiLabio, Gino A.
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Nature, 2008
Postdocs are attempting to organize and improve their lot worldwide — but results have been mixed. Paul Smaglik reports.
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Postdocs are attempting to organize and improve their lot worldwide — but results have been mixed. Paul Smaglik reports.
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Bonding strength in flexible electronics
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022Flexible electronics comprises several manufacturing techniques and material choices for assembling electronic circuits on plastic substrates. A fundamental characteristic in such assemblies is the performance and mechanical stability of bonding between rigid surface-mounted devices and flexible circuitry. This study quantifies bonding strength of 0402'
Korhonen, Arttu +3 more
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Bond Strength in Cold Roll Bonding
CIRP Annals, 1985Summary The mechanisms producing metallic bonds in cold welding are fracture of the contaminant surface film, extrusion of base material through the cracks and builoup of real contact and coalescing with base material of the opposite surface. Bay has earlier proposed a general model for the bond strength in cold welding based upon a continuum ...
Tarras Wanheim +3 more
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Acta Odontologica Scandinavica, 1996
No currently available bond test for dental metal ceramic systems has yet gained general acceptance. Such a bond test cannot be established without careful analysis of the stress distribution within the adherence region. The objective of the present study was to establish a mechanical shear stress test and combine the results with a finite element ...
Magnus Persson, Maud Bergman
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No currently available bond test for dental metal ceramic systems has yet gained general acceptance. Such a bond test cannot be established without careful analysis of the stress distribution within the adherence region. The objective of the present study was to establish a mechanical shear stress test and combine the results with a finite element ...
Magnus Persson, Maud Bergman
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A critique of bond strength measurements
Journal of Dentistry, 1989The lack of consistent values for dentine bond strengths in shear or in tension from what are superficially identical experimental procedures has led to ambiguities in the interpretation of the data. These variations in bond strength are usually considered to be related to different adhesive procedures.
I.C. Howard +3 more
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2005
The ability of the clinician to bond restorative materials to enamel has been an important achievement of modern dentistry. A variety of restorative materials that rely on enamel bonding are now available to the clinician. These materials include resin composites, compomers, hybrid ionomers, and glass ionomers.
W. H. Tate, John M. Powers
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The ability of the clinician to bond restorative materials to enamel has been an important achievement of modern dentistry. A variety of restorative materials that rely on enamel bonding are now available to the clinician. These materials include resin composites, compomers, hybrid ionomers, and glass ionomers.
W. H. Tate, John M. Powers
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Bond Strength of Bonded SOI Wafers
Japanese Journal of Applied Physics, 1992We developed a tensile strength measurement technique for bonded silicon-on-insulator (SOI) wafers. After oxidation, wafers are patterned, prior to bonding, to reduce the bonded area. After bonding and grinding, tensile strength is measured by pulling samples perpendicularly to the interface by holders adhesively fixed to the samples. The strength
Yoshihiro Arimoto, Fumitoshi Sugimoto
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1978
In the last chapter, in the section on molecular theories of fracture, almost throughout an Arrhenius equation has been used to describe the activation of element breakage. The energy of activation, U0, frequently turned out to be equal to (or was assumed to be equal to) the dissociation energy of the weakest main chain bond.
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In the last chapter, in the section on molecular theories of fracture, almost throughout an Arrhenius equation has been used to describe the activation of element breakage. The energy of activation, U0, frequently turned out to be equal to (or was assumed to be equal to) the dissociation energy of the weakest main chain bond.
openaire +2 more sources