Results 131 to 140 of about 73,378 (263)

From Artificial to Embodied and Physical Intelligence in Smart Manufacturing

open access: yesAdvanced Science, EarlyView.
Smart manufacturing is reframed through complementary artificial, embodied, and physical intelligence, spanning computational reasoning, perception‐action coupling, and material‐level adaptation. Their integration across design, fabrication, operation, and maintenance reveals how intelligence can be co‐designed across algorithms, embodied agents, and ...
Kang Wang   +9 more
wiley   +1 more source

Advances in Josephson Junction Materials and Processes Toward Practical Quantum Computing

open access: yesAdvanced Science, EarlyView.
Emerging materials for quantum computing, including crystalline materials, two‐dimensional van der Waals materials, two‐dimensional electron gas systems, ferromagnets, and unconventional (e.g., d‐wave) superconductors, offer opportunities to engineer next‐generation Josephson junctions.
Hyunseong Kim   +11 more
wiley   +1 more source

Methanol‐Regulated Interfacial Polymerization of Fluorinated Polyamide Membranes Enables Rapid Liquid Hydrocarbon Separation

open access: yesAdvanced Science, EarlyView.
Through methanol‐regulated interfacial polymerization (IP), bulky trifluoromethyl (‐CF3) groups are successfully integrated into polyamide networks. Unlike conventional membranes that suffer from severe solvent‐induced swelling, the fluorinated network sterically resists structural expansion.
Xingxiang Li   +9 more
wiley   +1 more source

A Compendium of Logic Gates Based on Reconfigurable Three‐Independent‐Gate Transistors Realized in FDSOI Hardware

open access: yesAdvanced Electronic Materials, EarlyView.
This work electrically characterizes sixteen logic gates built from three‐independent‐gate reconfigurable transistors fabricated on full‐scale 300 mm wafers using the industrial 22 nm fully depleted FDSOI process of GlobalFoundries. Static and time‐resolved measurements confirm correct operation, including a 1‐bit adder and reconfigurable AOI/OAI ...
Juan P. Martinez   +12 more
wiley   +1 more source

SPICE‐Compatible Compact Modeling of Cuprate‐Based Memristors Across a Wide Temperature Range

open access: yesAdvanced Electronic Materials, EarlyView.
A physics‐guided compact model for YBCO memristors is introduced, incorporating carrier trapping, field‐induced detrapping, and a differential balance equation to describe their switching dynamics. The model is compared with experiments and implemented in LTspice, allowing realistic circuit‐level simulations.
Thomas Günkel   +6 more
wiley   +1 more source

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