Results 151 to 160 of about 1,949,697 (379)

Influence of a Standard Heat Treatment on the Microstructure and Properties of Inconel X‐750 Produced by Laser Powder Bed Fusion

Advanced Engineering Materials, EarlyView.
Ni‐base superalloys produced using additive manufacturing (AM) have a different response to heat treatments when compared to their conventional counterparts. Due to such unpredictability, various alloys with industrial interest are currently overlooked in most prior AM research.
Guilherme Maziero Volpato, Adriano de Souza Pinto Pereira, Steffen Neumeier, Dachamir Hotza, Mathias Göken, Ulrich Tetzlaff, Márcio Celso Fredel   +6 more
wiley   +1 more source

A Near-Infrared CMOS Silicon Avalanche Photodetector with Ultra-Low Temperature Coefficient of Breakdown Voltage. [PDF]

Micromachines (Basel), 2021
Liu D, Li T, Tang B, Zhang P, Wang W, Liu M, Li Z.   +6 more
europepmc   +1 more source

Spatial gradient of dynamic nuclear spin polarization induced by breakdown of quantum Hall effect

, 2010
We studied spatial distribution of dynamic nuclear polarization (DNP) in a Hall-bar device in a breakdown regime of the quantum Hall effect (QHE). We detected nuclear magnetic resonance (NMR) signals from the polarized nuclear spins by measuring the Hall
Hashimoto, Yoshiaki, Katsumoto, Shingo, Kawamura, Minoru, Kono, Kimitoshi, Machida, Tomoki   +4 more
core   +1 more source

First‐Principles Modeling of Solid Solution Softening and Hardening Effects in Al–Mg–Zr–Si Aluminum Alloys

Advanced Engineering Materials, EarlyView.
The role of various alloying elements in face‐centered cubic aluminum on the barrier of a Shockley partial dislocation during its motion is presented. The study aims to understand how alloying atoms such as Mg, Si, and Zr affect the energy landscape for dislocation motion, thus influencing the solid solution hardening and softening in aluminum, which ...
Inna Plyushchay, Zhengqing Wei, Nebahat Bulut, Sibylle Gemming   +3 more
wiley   +1 more source

Impact of III-Nitride/Si Interface Preconditioning on Breakdown Voltage in GaN-on-Silicon HEMT. [PDF]

Micromachines (Basel), 2021
Khediri A, Talbi A, Jaouad A, Maher H, Soltani A.   +4 more
europepmc   +1 more source

A Simulative Approach for the Prediction of Mesoscale Residual Stress Fields in Solution‐Strengthened Ferritic Ductile Iron

Advanced Engineering Materials, EarlyView.
This study presents a 3D representative volume element‐based simulation approach to predict mesoscopic residual stress and strain fields in silicon solid solution‐strengthened ductile cast iron. By modeling phase transformation kinetics with an enhanced Johnson–Mehl–Avrami–Kolmogorov model, the effects of varying cooling rates on residual stresses are ...
Lutz Horbach, Oliver Schenk, Valérian Iss, Ali Rajaei, Jiali Zhang, Felix Weber, Christoph Broeckmann   +6 more
wiley   +1 more source

Study of Normally-Off AlGaN/GaN HEMT with Microfield Plate for Improvement of Breakdown Voltage. [PDF]

Micromachines (Basel), 2021
Xia X, Guo Z, Sun H.
europepmc   +1 more source

Simulation of air breakdown mechanism using different electrodes [PDF]

, 2011
Rapid growth in power sector of nation has given the opportunity to power engineers to protect the power equipment for reliable operation during their operating life.
Pradhan, S C, Srikant, A
core  

Wafer Bonding Technologies for Microelectromechanical Systems and 3D ICs: Advances, Challenges, and Trends

Advanced Engineering Materials, EarlyView.
This review explores wafer bonding technologies, covering wafer preparation, activation methods, and bonding mechanisms. It compares direct and indirect bonding, highlights recent advancements and future trends, and examines applications in 3D integration and packaging.
Abdul Ahad Khan, Tuan‐Khoa Nguyen, Quang Thang Trinh, Nam‐Trung Nguyen, Dzung Viet Dao, Yong Zhu   +5 more
wiley   +1 more source

Prediction of DC Breakdown Voltage of Rod–Plate Gaps under Full-Flame Bridging Conditions

Fire
In order to evaluate the risk of transmission line tripping due to wildfires, it is necessary to predict the breakdown voltage of the insulation gap under the flame.
Ziheng Pu, Yuan Li, Peng Li, Kuan Ye, Kai Zhou, Ruizhe Zhang   +5 more
doaj   +1 more source