Results 201 to 210 of about 1,949,697 (379)

Multimodal Characterization of Sn‐Bi Solder Alloy Solidification Using Synchrotron X‐Ray Microtomography and Energy Dispersive Diffraction

Advanced Engineering Materials, EarlyView.
Real‐time imaging and energy‐dispersive diffraction during solidification of Sn‐Bi alloy interconnect for electronic packaging applications are studied. Sn‐Bi solder alloys have generated significant interest in recent times due to their potential use in electronic packaging.
Amey Luktuke, John Wu, Alan L. Kastengren, Nikhilesh Chawla   +3 more
wiley   +1 more source

Novel 4H-SiC Double-Trench MOSFETs with Integrated Schottky Barrier and MOS-Channel Diodes for Enhanced Breakdown Voltage and Switching Characteristics. [PDF]

Nanomaterials (Basel)
Wang P, Li C, Deng C, Yang Q, Xu S, Tang X, Wang Z, Tao W, Tao N, Wang Q, Yu H.   +10 more
europepmc   +1 more source

Time-resolved voltage breakdown in various insulators due to 2-MeV electronics

, 1973
L.M. Erickson, Douglas C. Oakley
openalex   +1 more source

Effect of Annealing Temperature on Microstructure and Dry‐Sliding Behavior of Powder Bed Fusion–Laser Beam Ti6Al2Sn4Zr6Mo Alloy

Advanced Engineering Materials, EarlyView.
Heat treatment parameters critically affect the wear resistance of powder bed fusion–laser beam (PBF‐LB)‐produced Ti–6Al–2Sn–4Zr–6Mo alloy. This study found that optimizing annealing temperature allows to obtain a tailored microstructure, which enhances the dry‐sliding behavior by forming a stable and functional mechanically mixed layer (MML), ensuring
Gianluca Pirro, Lavinia Tonelli, Carla Martini, Alessandra Martucci, Mariangela Lombardi, Lorella Ceschini   +5 more
wiley   +1 more source

Deep Learning Method for Breakdown Voltage and Forward <i>I-V</i> Characteristic Prediction of Silicon Carbide Schottky Barrier Diodes. [PDF]

Micromachines (Basel)
Zhou H, Wang X, Wang S, Liu C, Chen D, Li J, Ma L, Zhang G.   +7 more
europepmc   +1 more source

A Novel Simplified Approach to Physically Simulate Wire‐Arc Directed Energy Deposition Conditions

Advanced Engineering Materials, EarlyView.
Scarcity of specialized titanium alloy wires and high experimental wire production costs impedes wire‐arc directed energy deposition (waDED) adoption in industry. A novel, wireless approach is introduced to accelerate and economize titanium alloy development.
Martin Klein, José L. Neves, Florian Pixner, Martin Stockinger, Thomas Klein   +4 more
wiley   +1 more source

Effect of DC Bias Voltage upon Treeing Breakdown in Epoxy Resin under Rectangular Pulse Voltage

, 1977
Hiroshi Nakayama, Shigeyuki Nagata, Toshihiko Yoshida, Yoshio Inuishi   +3 more
openalex   +2 more sources

Modeling soft breakdown under constant voltage stress in ultra thin gate oxides with PSpice circuit simulator [PDF]

, 2001
S. Evseev
openalex   +1 more source

Highly Stable Low‐Temperature Phosphate Glass as a Platform for Multimaterial 3D Printing of Integrated Functional Microfluidic Devices

Advanced Engineering Materials, EarlyView.
A highly stable, low‐temperature phosphate glass is developed for multimaterial additive manufacturing of multifunctional microfluidics. Glass, metal conductors, and sacrificial polymer are coprinted, enabling monolithic fabrication. The sacrificial paste forms precise channels and decomposes during sintering.
Babak Mazinani, Mustafa M. Fadlelmula, Vivek Subramanian   +2 more
wiley   +1 more source

Study on the influence of TiO2 nanoparticles on the breakdown voltage of transformer oil under severe cold conditions. [PDF]

PLoS One
Qin C, Lin W, Huang Y, Liu L, Hua H, Liang H.   +5 more
europepmc   +1 more source