Results 141 to 150 of about 34,140 (308)
Advancements in TLP Bonding for Power Electronics Die‐Attach Applications
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal +4 more
wiley +1 more source
Calculation method for brittle fracture of functional gradient materials. [PDF]
Qi C, Pi AG.
europepmc +1 more source
Mesh-Based and Meshfree Reduced Order Phase-Field Models for Brittle Fracture: One Dimensional Problems. [PDF]
Nguyen NH +4 more
europepmc +1 more source
Studies on Brittle Fracture of Steel in Slow Notch Bend Test
Yoshio ANDO
openalex +2 more sources
This critical review presents a comprehensive roadmap for the precision 3D printing of cellulose. Quantitative correlations link ink formulation and rheological properties to print fidelity and final material performance. This framework guides the development of advanced functional materials, from biomedical scaffolds to electromagnetic shielding ...
Majed Amini +3 more
wiley +1 more source
Experimental study on the influence of non-penetrating crack spatial distribution on brittle fracture process. [PDF]
Xu J, Luo S, Xiao X, Jin J.
europepmc +1 more source
Brittle fracture to recoverable plasticity: polytypism-dependent nanomechanics in todorokite-like nanobelts. [PDF]
Amin Shikder MR +7 more
europepmc +1 more source
Fabrication, Properties, and Applications of Scaffolds for Bone Tissue Regeneration
This review explores cutting‐edge biomaterials and fabrication techniques for scaffolds in bone tissue regeneration. It conducts a critical comparison of various strategies, meticulously analyzes the key contradictions in the field, and outlines an integrated development path spanning from biomaterial selection to clinical application, while ...
Shangsi Chen, Min Wang
wiley +1 more source

