Linear and Non-Linear Stress Analysis for the Prediction of Fracture Toughness for Brittle and Ductile Material using ASTM E399 and ASTM E1290 By ANSYS Program package [PDF]
Ameen Nassar, E G Fayyad
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Switchable Supramolecular Adhesive by Tuning Interfacial Bonding and Modulus
The supramolecular adhesive (HyDiP) shows reversible adhesion and recyclability. In the dehydrated state, it is dense, stiff (E ≈445 MPa), transparent, and provides strong bonding with adhesion strengths up to 4.65 MPa. In the hydrated state, it becomes porous, soft (E ≈0.11 MPa), and detaches easily, enabling sustainable high‐strength applications ...
Rumin Fu +10 more
wiley +1 more source
Damage accumulation of bovine bone under variable amplitude loads
Stress fractures, a painful injury, are caused by excessive fatigue in bone. This study on damage accumulation in bone sought to determine if the Palmgren-Miner rule (PMR), a well-known linear damage accumulation hypothesis, is predictive of fatigue ...
Abbey M. Campbell +3 more
doaj +1 more source
Post-Fire Susceptibility to Brittle Fracture of Selected Steel Grades Used in Construction Industry-Assessment Based on the Instrumented Impact Test. [PDF]
Maslak M +3 more
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Modelling and animation of brittle fracture in three dimensions [PDF]
Ayşe Küçükyılmaz
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Ultrathin AlOxHy interlayers between aluminum films and polymer substrates significantly improve electro‐mechanical properties of flexible thin film systems. By precisely controlling interlayer thickness using atomic layer deposition, this study identifies an optimal interlayer thickness of 5–10 nm that enhances ductility and delays cracking.
Johanna Byloff +9 more
wiley +1 more source
A New Methodology for Predicting Brittle Fracture of Plastically Deformable Materials: Application to a Cold Shell Nosing Process. [PDF]
Eom JG +4 more
europepmc +1 more source
Conductive Bonding and System Architectures for High‐Performance Flexible Electronics
This review outlines bonding technologies and structural design strategies that support high‐performance flexible and stretchable electronics. Bonding approaches such as surface‐activated bonding and anisotropic conductive films, together with system‐level architectures including buffer layers and island‐bridge structures, possess distinct mechanical ...
Kazuma Nakajima, Kenjiro Fukuda
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Introduction: Monocrystal SiC is representative of the third generation semiconductor materials, the efficient process technology of 6H-SiC wafer have always been a hot topic.
Binbin Meng, Chen Li
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Hydrogen-Assisted Brittle Fracture Behavior of Low Alloy 30CrMo Steel Based on the Combination of Experimental and Numerical Analyses. [PDF]
Li Y, Zhang K, Lu D, Zeng B.
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